Workpiece processing method
AssigneeDisco Corporation
InventorsKarl Heinz Priewasser, Akiko Kigawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeDisco Corporation
InventorsKarl Heinz Priewasser, Akiko Kigawa
Estimating the term…
In a processing method, a surface protective tape peeling step of peeling a surface protective tape off the top surface of a wafer is performed in a state in which an expanding sheet is expanded while a preliminary expanding step of expanding the expanding sheet is performed after an affixing step is performed. Therefore, the surface protective tape can be peeled off the top surface of the wafer while a tension is applied to the expanding sheet. It is thereby possible to prevent chips from coming into contact with each other and being damaged. When an expanding step is thereafter performed, the expanding sheet is expanded by an amount of expansion which amount is a value larger than an amount of expansion of the expanding sheet in the preliminary expanding step. Thus, sufficient intervals can be formed between the chips, and the chips can be transported smoothly.
A workpiece processing method of processing a workpiece having division starting points formed within the workpiece along a plurality of intersecting planned dividing lines, and having a surface protective tape affixed to a top surface of the workpiece, or a workpiece divided into individual chips along a plurality of intersecting planned dividing lines, and having a surface protective tape affixed to a top surface of the workpiece, the workpiece processing method comprising:
Dependencies are inferred from the claim text.