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US 10,475,675 B2Granted
Manufacturing apparatus and manufacturing method of semiconductor device
AssigneeToshiba Memory Corporation
InventorsJun Tanaka, Masaya Shima
Life of this patent
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Abstract
An apparatus for manufacturing a semiconductor device includes a stage configured to hold tape adhering to a second surface of a semiconductor wafer having the second surface and a first surface opposite to the second surface, a vacuum mechanism attachable to an upper side of a substrate provided to adhere to the first surface, a driving unit configured to drive the vacuum mechanism in a direction by which the vacuum mechanism is separated from the substrate, and a cooling unit configured to cool the tape.
Claims9
A method for manufacturing a semiconductor device comprising:
- forming a wiring layer on a first surface of a semiconductor wafer having the first surface and a second surface facing away from the first surface;
- forming an insulation layer covering the wiring layer on the first surface of the semiconductor wafer;
- bonding a substrate on the insulation layer with an adhesive layer between the insulation layer and the substrate;
- forming a contact extending through the semiconductor wafer, the contact comprising a convex portion adjacent to the second surface;
- affixing tape on the second surface of the semiconductor wafer;
- increasing the elastic modulus of the tape;
- and
- separating the substrate from the first surface of the semiconductor wafer after increasing the elastic modulus of the tape, wherein
- the contact is electrically connected to the wiring layer.
6 more elements
Dependencies are inferred from the claim text.