Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack
AssigneeEV Group E. Thallner GmbH
InventorAndreas Fehkuhrer
Life of this patent
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Abstract
A device and method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack. The device has at least one ring, whereby the substrate stack can be placed within the at least one ring, the at least one ring having a plurality of nozzles. The nozzles are arranged distributed at least over a portion of the periphery of the at least one ring, the nozzles directed onto the connecting layer. The device sprays solvent from the nozzles onto an edge area of the connecting layer.
Claims19
A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising:
- a plurality of rings arranged one next to the other and vertically one above the other, each of said rings having an inner circumference and being equipped with a plurality of holding chucks extending inward from said inner circumference, said holding chucks being configured to receive and hold the substrate stack;
- and
- a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer.
A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising:
- a plurality of rings arranged one next to the other and vertically one above the other, an inside of each of said rings being dimensioned to receive the substrate stack;
- and
- a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer;
- a receiving system configured to transport the substrate stack to and/or away from each of said rings, said receiving system being further configured to move in a vertical direction;
- and
- one or more additional nozzles configured to clean a bottom of the substrate stack, said additional nozzles being located below the receiving system and/or in a lowermost ring, said additional nozzles pointing toward a direction of a center of the substrate stack.
A device for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, the substrate stack having at least two substrates that are temporarily bonded to each other with the connecting layer, the device comprising:
- a plurality of rings arranged one next to the other and vertically one above the other, an inside of each of said rings being dimensioned to receive the substrate stack;
- a plurality of nozzles arranged at least over a portion of a periphery of each of the rings, each of the nozzles being directed toward the connecting layer of the substrate stack, each of the nozzles being configured to spray a solvent onto an edge area of the connecting layer;
- and
- a pivoting arm with at least one nozzle for cleaning the substrate stack.
A method for at least partial loosening of a connecting layer of a temporarily bonded substrate stack, said substrate stack comprised of at least two substrates temporarily bonded to each other with the connecting layer, the method comprising:
- placing the substrate stack inside a ring of a device comprised of a plurality of rings arranged one next to the other, each ring having a plurality of nozzles that are arranged at least over a portion of a periphery of the ring, wherein each of said nozzles receives a solvent;
- directing the nozzles toward the connecting layer;
- and
- spraying the solvent onto an edge area of the connecting layer.
Dependencies are inferred from the claim text.