Semiconductor module and conductive member for semiconductor module including cut in bent portion
AssigneeMitsubishi Electric Corporation
InventorsMasakazu Tani, Yoshiyuki Deguchi, Kazuki Sakata
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AssigneeMitsubishi Electric Corporation
InventorsMasakazu Tani, Yoshiyuki Deguchi, Kazuki Sakata
Estimating the term…
A semiconductor module is provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode. The conductive member is made up of a metal sheet, and has a bent portion at the one end and at the other end. The bent portion provided at the one end has a cut in a leading end portion, in the longitudinal direction, and an end joining section at which the cut is not present is joined to the electrode of the semiconductor element. As a result, a semiconductor module can be realized that allows combination of increased current capacity with improved reliability.
A semiconductor module provided with a conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode,
A conductive member for a semiconductor module, being a conductive member that is used in a semiconductor module, the conductive member having one end, in a longitudinal direction, joined to an electrode of a semiconductor element that is mounted on an insulating substrate, inside the semiconductor module, the other end of the conductive member in the longitudinal direction being joined to a component different from the electrode, wherein
Dependencies are inferred from the claim text.