Heating method, film forming method, semiconductor device manufacturing method, and film forming apparatus
AssigneeTokyo Electron Limited
InventorsTakahiro Miyahara, Hiroki Murakami
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Abstract
There is provided heating method for heating a substrate having a germanium film or a silicon germanium film formed on a surface of the substrate, the method including: loading the substrate kept in an air atmosphere at least a predetermined time into a processing container; and heating the substrate in a state in which an interior of the processing container is kept in a hydrogen gas-containing atmosphere.
Claims9
A heating method for heating a substrate having a germanium film or a silicon germanium film formed on a surface of the substrate, the method comprising:
- loading the substrate kept in an air atmosphere at least a predetermined time into a processing container;
- and
- heating the substrate in a state in which an interior of the processing container is kept in a hydrogen gas-containing atmosphere.
A film forming method for forming a high dielectric constant film on a substrate having a germanium film or a silicon germanium film formed on a surface of the substrate, the method comprising:
- loading the substrate kept in an air atmosphere at least a predetermined time into a processing container of a film forming apparatus;
- heating the substrate at least up to a film formation temperature in a state in which an interior of the processing container is kept in a hydrogen gas-containing atmosphere;
- and
- forming the high dielectric constant film on a surface of the germanium film or the silicon germanium film by supplying a film forming raw material gas for forming the high dielectric constant film and an oxidizing gas after the substrate has reached the film formation temperature.
A semiconductor device manufacturing method, comprising:
- forming a germanium film or a silicon germanium film on a semiconductor substrate via an insulating film;
- forming a high dielectric constant film on the germanium film or the silicon germanium film;
- forming a conductive film on the high dielectric constant film;
- and
- forming a channel portion comprising the germanium film or the silicon germanium film, a source electrode, a drain electrode, a gate insulating film comprising the high dielectric constant film, and a gate electrode comprising the conductive film, by etching the conductive film and the high dielectric constant film, and by implanting ions into the germanium film or the silicon germanium film,
- wherein after forming the germanium film or the silicon germanium film, the semiconductor substrate kept in an air atmosphere at least a predetermined time is loaded into a processing container of a film forming apparatus for forming the high dielectric constant film, and the semiconductor substrate is heated at least up to a film formation temperature in a state in which an interior of the processing container is kept in a hydrogen gas-containing atmosphere.
Dependencies are inferred from the claim text.