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US 10,475,664 B2Granted
Wafer stacking to form a multi-wafer-bonded structure
AssigneeRaytheon Company
InventorsAndrew Cahill, Jonathan Getty, Daniel D. Lofgreen, Paul A. Drake
Life of this patent
Estimating the term…
Abstract
In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure.
Claims18
A method, comprising:
- heating a wafer chuck;
- heating a first wafer having a coefficient of thermal expansion (CTE);
- depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck;
- spinning the wafer chuck to spread the first epoxy at least partially across the first wafer;
- placing a second wafer having a CTE different from the first wafer over the first epoxy disposed on the first wafer by using a centering ring having an opening that is sized to receive the second wafer, wherein the second wafer remains spaced apart from the first epoxy after the second wafer is placed over the first wafer;
- and
- bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure, wherein the second wafer comes in contact with the first epoxy as a result of the vacuum being applied to the first wafer and the second wafer.
4 more elements
A method, comprising:
- heating a wafer chuck;
- heating a first wafer disposed on the wafer chuck;
- depositing a first epoxy along at least a portion of a surface of the first wafer;
- suspending, via a centering ring, a second wafer above the surface of the first wafer, the centering ring having an interior opening that is sized to receive the first wafer, the second wafer being suspended above the surface of the first wafer via one or more air pockets formed in the interior opening of the centering ring between the first wafer and the second wafer;
- and
- bonding the second wafer to the first epoxy.
3 more elements
Dependencies are inferred from the claim text.