Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

A method of manufacturing a semiconductor device, the method comprising:

• heating a heat insulating plate, which is held by a substrate holder configured to hold a substrate, to a processing temperature, at which the substrate is processed, by an electromagnetic wave supplied from a heating device, and measuring a temperature change of the heat insulating plate by a non-contact type thermometer until the heat insulating plate reaches the processing temperature;
• heating the substrate, which is held by the substrate holder, to the processing temperature by the heating device, and measuring a temperature change of the substrate by the non-contact type thermometer until the substrate reaches the processing temperature;
• obtaining a correlation between the temperature change of the heat insulating plate and the temperature change of the substrate according to a measurement result of the temperature change of the heat insulating plate and a measurement result of the temperature change of the substrate;
• and
• heating the substrate by controlling the heating device based on the temperature of the heat insulating plate measured by the non-contact type thermometer and the correlation.