Patterning method
AssigneesUnited Microelectronics Corp., Fujian Jinhua Integrated Circuit Co., Ltd.
InventorsYu-Chen Chuang, Fu-Che Lee, Ming-Feng Kuo, Cheng-Yu Wang, Hsien-Shih Chu, Li-Chiang Chen
Life of this patent
Estimating the term…
Loading patent…
AssigneesUnited Microelectronics Corp., Fujian Jinhua Integrated Circuit Co., Ltd.
InventorsYu-Chen Chuang, Fu-Che Lee, Ming-Feng Kuo, Cheng-Yu Wang, Hsien-Shih Chu, Li-Chiang Chen
Estimating the term…
A patterning method includes the following steps. A hard mask layer is formed on a substrate. Mandrels are formed on the hard mask layer. Mask patterns are formed on the mandrels. Each of the mask patterns is formed on one of the mandrels. Spacers are formed on the hard mask layer. Each of the spacers is formed on a sidewall of one of the mandrels and on a sidewall of one of the mask patterns. A cover layer covering the hard mask layer, the spacers and the mask patterns is formed. A planarization process is performed to remove the cover layer on the mask patterns and the spacer and remove the mask patterns. A part of the cover layer remains between the spacers after the planarization process. The mandrels and the cover layer are removed after the planarization process.
A patterning method, comprising:
Dependencies are inferred from the claim text.