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US 10,475,641 B2Granted
Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsKohei Fukushima, Hiromi Nitadori
Life of this patent
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Abstract
A substrate processing apparatus includes an inner tube installed to accommodate a plurality of substrates and having a first opening, an outer tube configured to surround the inner tube, a movable wall installed inside the inner tube or between the inner tube and the outer tube, configured to be movable, and having a second opening, a gas supply part configured to supply a process gas to the substrates and an exhaust part installed outside the movable wall and configured to exhaust the process gas supplied to the substrates.
Claims10
A substrate processing apparatus, comprising:
- an inner tube installed to accommodate a plurality of substrates, and having a first opening;
- an outer tube configured to surround the inner tube;
- a movable wall installed inside the inner tube or between the inner tube and the outer tube, and having a second opening;
- a rotary shaft coupled to the movable wall and configured to rotate to move the movable wall;
- a gas supply part configured to supply a process gas to the substrates;
- an exhaust part installed outside the movable wall, and configured to exhaust the process gas supplied to the substrates;
- and
- a control part configured to control an operation of the rotary shaft,
- wherein the control part is further configured to control the operation of the rotary shaft to change a shape of an opening formed by overlapping the first opening and the second opening.
6 more elements
Dependencies are inferred from the claim text.