System, method and computer program product for inspecting a wafer using a film thickness map generated for the wafer
AssigneeKLA-Tencor Corporation
InventorGordon Charles Rouse
Life of this patent
Estimating the term…
Abstract
A system, method, and computer program product are provided for inspecting a wafer using a film thickness map generated for the wafer. In use, a plurality of locations on a wafer are determined from a design of the wafer. Additionally, a measured brightness at each of the determined locations on the wafer is obtained. Further, a film thickness map for the wafer is generated from the obtained measurements. The wafer is then inspected using the film thickness map.
Claims17
A method, comprising:
- determining, by a computer processor from a design of a wafer, a plurality of locations on the wafer;
- obtaining, by the computer processor, a measured brightness at each of the determined locations on the wafer;
- generating, by the computer processor from the obtained measurements, a film thickness map for the wafer by
- storing a mapping of each of the determined locations on the wafer to a corresponding measured brightness obtained for the determined location,
- interpolating the measured brightness at each of the determined locations to calculate brightness for additional locations on the wafer not included in the determined locations, and
- storing a mapping of each of the additional locations on the wafer to the calculated brightness for the additional location;
- inspecting, by the computer processor, the wafer using the film thickness map.
A non-transitory computer readable medium storing computer code executable by a computer processor to perform a method comprising:
- determining, by a computer processor from a design of a wafer, a plurality of locations on the wafer;
- obtaining, by the computer processor, a measured brightness at each of the determined locations on the wafer;
- generating, by the computer processor from the obtained measurements, a film thickness map for the wafer by
- storing a mapping of each of the determined locations on the wafer to a corresponding measured brightness obtained for the determined location,
- interpolating the measured brightness at each of the determined locations to calculate brightness for additional locations on the wafer not included in the determined locations, and
- storing a mapping of each of the additional locations on the wafer to the calculated brightness for the additional location;
- inspecting, by the computer processor, the wafer using the film thickness map.
An inspection system, comprising:
- a memory and a processor for:
- determining, from a design of a wafer, a plurality of locations on the wafer;
- obtaining a measured brightness at each of the determined locations on the wafer;
- generating, from the obtained measurements, a film thickness map for the wafer by
- storing a mapping of each of the determined locations on the wafer to a corresponding measured brightness obtained for the determined location,
- interpolating the measured brightness at each of the determined locations to calculate brightness for additional locations on the wafer not included in the determined locations, and
- storing a mapping of each of the additional locations on the wafer to the calculated brightness for the additional location;
- inspecting the wafer using the film thickness map.
Dependencies are inferred from the claim text.