Miniaturized radio frequency identification tag
AssigneeOnchip, Ltd.
InventorJohn Sonnenberg
Life of this patent
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Abstract
The invention provides a miniaturized radio frequency identification tag, which comprises a radio frequency identification chip and an antenna. The antenna comprises a plurality of loop antenna line segments. Each of loop antenna line segments is disposed on a corresponding insulating layer, and electrically connected to the radio frequency identification chip or the other loop antenna line segment via a corresponding conductive through hole. Accordingly, the structure of the antenna is fabricated by multi-layer loop antenna line segments so as to reduce the size of the radio frequency identification tag, effectively.
Claims16
A miniaturized radio frequency identification tag, comprising:
- a radio frequency identification chip comprising an active surface, the active surface comprising a first antenna bonding pad and a second antenna bonding pad;
- a first insulation layer, configured on the radio frequency identification chip, used for covering the radio frequency identification chip, and comprising a first conductive through hole and a second conductive through hole, wherein the first conductive through hole is configured on the first antenna bonding pad of the radio frequency identification chip, and the second conductive through hole is configured on the second antenna bonding pad of the radio frequency identification chip;
- a first loop antenna line segment configured on the first insulation layer, wherein the first loop antenna line segment is provided at one end thereof with a first connection pad, and provided at other thereof with a second connection pad, the first connection pad of the first loop antenna line segment is electrically connected to the first antenna bonding pad of the radio frequency identification chip via the first conductive through hole;
- a first connection line segment configured on the first insulation layer, wherein the first connection line segment is electrically connected to the second antenna bonding pad of the radio frequency identification chip via the second conductive through hole;
- a second insulation layer, configured on the first insulation layer, used for covering the first loop antenna line segment and the first connection line segment, and comprising a third conductive through hole and a fourth conductive through hole;
- a second loop antenna line segment configured on the second insulation layer, wherein the second loop antenna line segment is provided at one end thereof with a third connection pad, and provided at other thereof with a fourth connection pad, the third connection pad of the second loop antenna line segment is electrically connected to the second connection pad of the first loop antenna line segment via the third conductive through hole, the fourth connection pad of the second loop antenna line segment is electrically connected to the first connection line segment via the fourth conductive through hole;
- and
- a third insulation layer, configured on the second insulation layer, and used for covering the second loop antenna line segment.
Dependencies are inferred from the claim text.