Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorYuuji Takimoto
Life of this patent
Estimating the term…
Abstract
Disclosed is substrate processing apparatus including a plurality of processing units, each of which processes a substrate, and a controller that causes each of the processing units to execute a substrate processing. The controller is configured to cause a processing unit with a detected abnormality to execute an improvement processing based on abnormality detection information including a content of abnormality detected by a substrate surface measurement after causing the substrate processing to be performed in each of the processing units. The improvement processing is specified from improvement processing information in which the content of abnormality and the improvement processing are correlated with each other.
Claims16
A substrate processing apparatus comprising:
- a plurality of processing units, each of which has an associated unit ID, wherein each processing unit comprises a substrate holder configured to hold and rotate the substrate, a dummy dispenser, and a nozzle configured to eject an etching liquid either onto the substrate or into the dummy dispenser;
- and
- a controller configured to cause each of the processing units to execute a substrate etching processing,
- wherein after the substrate etching processing, a particle parameter and an etching parameter are measured and compared with a respective predetermined normal range and a predetermined abnormal range by the controller, and when the particle parameter and the etching parameter fall into the respective predetermined abnormal range, the controller associates the unit ID for a corresponding processing unit with a detected abnormality and an abnormality ID associated with the respective predetermined abnormal range;
- wherein the controller is configured to associate an improvement processing ID to each abnormality ID it receives, and the improvement processing ID corresponds to instructions that when executed by the controller, causes the processing unit with the detected abnormality to execute an improvement processing;
- and
- wherein when the abnormality ID represents an etching defect, the associated improvement processing ID corresponds to instructions that when executed by the controller causes the processing unit with the detected abnormality to execute, as the improvement processing, a dummy dispensing processing of ejecting the etching liquid into the dummy dispenser from the nozzle and the controller is configured to increase a processing time of the dummy dispensing processing as a level of the etching defect increases.
A substrate processing method for a plurality of processing units, each of which has an associated unit ID, wherein each processing unit comprises a substrate holder configured to hold and rotate the substrate, a dummy dispenser, and a nozzle configured to eject an etching liquid either onto the substrate or into the dummy dispenser, the method comprising:
- performing a substrate etching processing in a plurality of the processing units;
- measuring an etching parameter and a particle parameter;
- comparing the etching parameter and the particle parameter with a respective predetermined normal range and a predetermined abnormal range, and when the etching parameter and particle parameter fall into the respective predetermined abnormal range, associating the unit ID for a corresponding processing unit with a detected abnormality and an abnormality ID associated with the respective predetermined abnormal range;
- associating an improvement processing ID to the abnormality ID;
- and
- performing an improvement processing corresponding to the improvement processing ID with respect to the processing unit with the detected abnormality,
- wherein when the abnormality ID represents an etching defect, the associated improvement processing ID corresponds to instructions that when executed by the controller causes the processing unit with the detected abnormality to execute, as the improvement processing, a dummy dispensing processing of ejecting the etching liquid into the dummy dispenser from the nozzle and the controller is configured to increase a processing time of the dummy dispensing processing as a level of the etching defect increases.
A substrate processing apparatus comprising:
- a plurality of processing units, each of which has an associated unit ID, wherein each processing unit comprises a substrate holder configured to hold and rotate the substrate, a dummy dispenser, and a nozzle configured to eject an etching liquid either onto the substrate or into the dummy dispenser;
- and
- a controller configured to cause each of the processing units to execute a substrate etching processing,
- wherein during the substrate etching processing, an etching parameter will be measured and compared with a predetermined normal range and a predetermined abnormal range, and when the etching parameter falls into the predetermined abnormal range, the controller associates the unit ID for a corresponding processing unit with a detected abnormality and an abnormality ID associated with the respective predetermined abnormal range;
- wherein the controller is configured to associate an improvement processing ID to each abnormality ID it receives, and the improvement processing ID corresponds to instructions that when executed by the controller, causes the processing unit with the detected abnormality to execute an improvement processing,
- wherein when the abnormality ID represents an etching defect, the associated improvement processing ID corresponds to instructions that when executed by the controller causes the processing unit with the detected abnormality to execute, as the improvement processing, a dummy dispensing processing of ejecting the etching liquid into the dummy dispenser from the nozzle, and the controller is configured to increase a processing time of the dummy dispensing processing as a level of the etching defect increases.
Dependencies are inferred from the claim text.