Method and apparatus for post exposure processing of photoresist wafers

A substrate processing method, comprising:

• positioning a substrate on a first electrode within a process volume;
• moving a second electrode to a process position adjacent the substrate;
• introducing a process fluid to the process volume, wherein the moving the second electrode to the process position is performed prior to, during, or after the introducing the process fluid to the process volume;
• generating an electric field between the first electrode and the second electrode and applying the electric field to the substrate via the process fluid;
• and
• removing the process fluid from the process volume.

A substrate processing method, comprising:

• positioning a substrate on a first electrode within a process volume;
• moving a second electrode to a process position adjacent the substrate;
• introducing a process fluid to the process volume;
• generating an electric field between the first electrode and the second electrode and applying the electric field to the substrate via the process fluid;
• removing the process fluid from the process volume;
• removing the substrate from the process volume;
• and
• positioning the substrate on a cooling pedestal.

A substrate processing method, comprising:

• positioning a substrate on a first electrode within a process volume;
• moving the first electrode to a process position adjacent a second electrode disposed in the process volume;
• introducing a process fluid to the process volume between the substrate and the second electrode;
• generating an electric field between the first electrode and the second electrode and applying the electric field to the substrate via the process fluid;
• removing the process fluid from the process volume;
• introducing a rinse fluid to the process volume;
• rotating the substrate to remove the rinse fluid from the substrate;
• and
• removing the rinse fluid from the process volume.

A substrate processing method, comprising:

• positioning a substrate on a first electrode within a process volume;
• moving the first electrode to a process position adjacent a second electrode disposed in the process volume;
• introducing a process fluid to the process volume between the substrate and the second electrode, wherein the moving the first electrode to the process position is performed prior to, during, or after the introducing the process fluid to the process volume;
• and
• generating an electric field between the first electrode and the second electrode and applying the electric field to the substrate via the process fluid.

A substrate processing method, comprising:

• positioning a substrate on a first electrode coupled to a chamber door;
• rotating the chamber door to a process position in which a major axis of the substrate is oriented vertically;
• delivering a process fluid to a process volume, wherein the process volume is at least partially defined by chamber sidewalls and a second electrode;
• and
• generating an electric field between the first electrode and the second electrode and applying the electric field to the substrate via the process fluid.