Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board

Abstract

A photosensitive resin composition contains (a) a polyimide which has, at a terminal of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, (b) a monomer, (c) a thermally crosslinkable compound, (d) a photopolymerization initiator and (e) a polymerization inhibitor, wherein the polymerization inhibitor (e) is a compound obtained by adding at least one hydroxyl group, alkoxy group, aryloxy group or aralkyloxy group to a naphthalene skeleton or an anthracene skeleton of a compound having a naphthalene skeleton or an anthracene skeleton.

Dependencies are inferred from the claim text.