FPC-attached optical modulator and optical transmission apparatus using same
AssigneeSumitomo Osaka Cement Co., Ltd.
InventorsToru Sugamata, Norikazu Miyazaki
Life of this patent
Estimating the term…
Abstract
An optical modulator includes: an optical modulation element which includes signal electrodes; lead pins; and a relay substrate in which a conductor pattern which electrically connects each of the lead pins and each of the signal electrodes to each other are formed, and the optical modulator is configured such that the amount of radiation of a high frequency at a connection portion between the conductor pattern and the signal electrode is increased compared to a portion other than the connection portion.
Claims16
An optical modulator comprising:
- an optical modulation element including a plurality of signal electrodes;
- a plurality of lead pins for inputting a high-frequency signal;
- a relay substrate in which conductor patterns that electrically connect the lead pins and the signal electrodes are formed;
- and
- a ground pattern provided on a front surface of the relay substrate,
- wherein the ground pattern provided on the front surface of the relay substrate is connected to a ground pattern provided on a back surface of the relay substrate through a plurality of via holes,
- the ground pattern on the front surface has a part which extends with a constant width from an edge of the relay substrate closest to a connection portion between the conductor pattern and the signal electrode, and
- a diameter of each of the via holes which is provided in the part and within a predetermined distance range from an edge of the relay substrate closest to the connection portion, is smaller than a diameter of each of the via holes which is provided in the part and outside the predetermined distance range.
An optical modulator comprising:
- an optical modulation element including a plurality of signal electrodes;
- a plurality of lead pins for inputting a high-frequency signal;
- a relay substrate in which conductor patterns that electrically connect the lead pins and the signal electrodes are formed;
- and
- a ground pattern provided on a front surface of the relay substrate,
- wherein the ground pattern provided on the front surface of the relay substrate is connected to a ground pattern provided on a back surface of the relay substrate through a plurality of via holes,
- the via hole is not provided within a range of a distance d11 from an edge of the relay substrate closest to a connection portion between the conductor pattern and the signal electrode, and
- the distance d11 is twice or more than a distance d12 from the ground pattern on the front surface to the conductor pattern adjacent to said ground pattern on the front surface.
An optical modulator comprising:
- an optical modulation element including a plurality of signal electrodes;
- a plurality of lead pins for inputting a high-frequency signal;
- a relay substrate in which conductor patterns that electrically connect the lead pins and the signal electrodes are formed;
- and
- a ground pattern which is provided on a front surface of the relay substrate,
- wherein the ground pattern provided on a front surface of the relay substrate has a portion with a width d22 which extends along a length direction of the conductor pattern adjacent to said ground pattern, within a range of a distance d21 from an edge of the relay substrate closest to a connection portion between the conductor pattern and the signal electrode,
- the distance d21 is twice or more than a width d23 of the adjacent conductor pattern, and
- the width d22 is equal to or less than ten times the width d23.
An optical modulator comprising:
- an optical modulation element including a plurality of signal electrodes;
- a plurality of lead pins for inputting a high-frequency signal;
- a relay substrate in which conductor patterns that electrically connect the lead pins and the signal electrodes are formed;
- and
- a ground pattern which is provided on a front surface of the relay substrate,
- wherein the front surface has an area which includes an edge of the relay substrate closest to a connection portion between the conductor pattern and the signal electrode and into which the conductor pattern extends but the ground pattern on the front surface does not extend.
An optical modulator comprising:
- an optical modulation element including a plurality of signal electrodes;
- a plurality of lead pins for inputting a high-frequency signal;
- a relay substrate in which conductor patterns that electrically connect the lead pins and the signal electrodes are formed;
- and
- a ground pattern which is provided on a front surface of the relay substrate,
- wherein the conductor pattern forms a coplanar line together with the ground pattern on the front surface and a structure connected to a ground potential which comes into contact with a back surface of the relay substrate,
- the back surface has an area which includes an edge of the relay substrate closest to a connection portion between the conductor pattern and the signal electrode and which is not electrically connected to the structure through a conductive material, and
- the back surface is electrically connected, in a portion outside the area, to the structure through a conductive material.
An optical modulator comprising:
- an optical modulation element which includes a plurality of signal electrodes;
- a plurality of lead pins for inputting a high-frequency signal;
- and
- a relay substrate in which conductor patterns which electrically connect the lead pins and the signal electrodes are formed on a front surface thereof,
- wherein the front surface of the relay substrate and a surface of the optical modulation element on which the signal electrodes are formed form a step at a portion where the conductor pattern and the signal electrode are connected to each other, and
- wherein the step is a level difference between the front surface of the relay substrate and the surface of the optical modulation element.
Dependencies are inferred from the claim text.