Hermetically sealed MEMS mirror and method of manufacture
AssigneeSTMicroelectronics S.r.l.
InventorsGiorgio Allegato, Sonia Costantini, Federico Vercesi, Roberto Carminati
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Abstract
Disclosed herein is a micro-electro mechanical (MEMS) device including a substrate, and a MEMS mirror stack on the substrate. A first bonding layer seals against ingress of environmental contaminants and mechanically anchors the MEMS mirror stack to the substrate. A cap layer is formed on the MEMS mirror stack. A second boding layer seals against ingress of environmental contaminants and mechanically anchors the cap layer to the MEMS mirror stack.
Claims11
A micro-electro mechanical system (MEMS) device, comprising:
- a substrate;
- a MEMS mirror stack on the substrate and having a width greater than a width of the substrate in at least one direction;
- a first bonding layer sealing against ingress of environmental contaminants and mechanically anchoring the MEMS mirror stack to the substrate;
- an interconnection layer stacked on the first bonding layer and in contact with the MEMS mirror stack;
- a support layer stacked on the first bonding layer;
- a transparent cap layer on the MEMS mirror stack;
- a second bonding boding layer sealing against ingress of environmental contaminants and mechanically anchoring the transparent cap layer to the MEMS mirror stack;
- at least one pad extending away from the MEMS mirror stack opposite the transparent cap layer and left exposed by the MEMS mirror stack having a width greater than the width of the substrate in the at least one direction;
- and
- a metal layer running from the MEMS mirror stack, through the interconnection layer, through the support layer, and to the at least one pad.
A micro-electro mechanical system (MEMS) device, comprising:
- a substrate having a first recess defined therein;
- a first bonding layer disposed on the substrate;
- a support layer stacked on the first bonding layer;
- a MEMS mirror stack disposed on the first bonding layer and having a width greater than a width of the substrate in at least one direction;
- an interconnection layer stacked on the first bonding layer and in contact with the MEMS mirror stack;
- a second bonding layer disposed on the MEMS mirror stack;
- and
- a transparent cap layer disposed on the second bonding layer and having a second recess defined therein;
- wherein the MEMS mirror stack includes a rotor that rotates to travel through the first and second recesses;
- wherein the first and second bonding layers environmentally seal against environmental egress into the first and second recesses;
- at least one pad extending away from the MEMS mirror stack opposite the transparent cap layer and left exposed by the MEMS mirror stack having a width greater than the width of the substrate in the at least one direction;
- and
- a metal layer running from the MEMS mirror stack, through the interconnection layer, through the support layer, and to the at least one pad.
Dependencies are inferred from the claim text.