Proximity sensor package having one or more grooves in a module cap

A device, comprising:

• a sensor package, comprising:
• an optical source configured to emit a beam of photons;
• an optical detector configured to receive a reflection of the beam of photons off an object external to the device;
• a module cap encompassing the optical source and the optical detector and defining an exterior surface of the sensor package, the module cap having a central portion disposed between the optical source and the optical detector and a peripheral portion disposed around the optical source and the optical detector, the central portion of the module cap having at least one surface directed away from the optical detector;
• a first aperture extending completely through the module cap and aligned with the optical source, the first aperture defining an emission cone of the sensor package;
• and
• a second aperture extending completely through the module cap and aligned with the optical detector, the second aperture defining a field-of-view of the sensor package, wherein a maximum thickness of the central portion of the module cap is higher than a maximum thickness of the peripheral portion of the module cap, wherein the central portion of the module cap comprises a plurality of grooves.

A method of forming a sensor package, the method comprising:

• attaching a source to an attachment pad, the source configured to emit a beam of radiation, over a substrate;
• attaching a detector to the attachment pad, detector configured to receive a first reflection of the beam of radiation, over the substrate;
• and
• encapsulating the attachment pad, the source, the detector with an optical encapsulant while forming a first aperture and a second aperture, the optical encapsulant comprising an isolation structure between the source and the detector, the isolation structure comprising a plurality of grooves comprising one or more surfaces having a one or more surface normals directed away from the detector, wherein the first aperture extends completely through the optical encapsulant to an exposed outer surface of the sensor package, the first aperture comprising first sidewalls extending away from a major surface of the source, wherein the second aperture extends completely through the optical encapsulant to the outer surface of the sensor package, the second aperture comprising second sidewalls extending away from a major surface of the detector, wherein each of the plurality of grooves comprises a first groove sidewall parallel to the first sidewalls of the first aperture and a second groove sidewall oriented at an acute angle with the first groove sidewall.