Cooled fan for micro-climate control

A micro-climate control system, comprising:

• a fan assembly;
• a thermoelectric system integrated with the fan assembly and being operable to actively cool or heat air as the air passes through the fan assembly, the thermoelectric system comprising:
• a thermoelectric heat pump;
• a heat reject subsystem;
• and
• a heat accept subsystem;
• wherein the fan assembly is operable to:
• draw air from a space to be conditioned;
• output conditioned air passed through one of the heat reject subsystem and the heat accept subsystem to the space to be conditioned;
• and
• output air passed through the other one of the heat reject subsystem and the heat accept subsystem away from the space to be conditioned;
• and
• a shroud placed around the heat reject subsystem and the heat accept subsystem which separates the conditioned and reject airflow from each other and directs each airflow.

A micro-climate control system, comprising:

• a fan assembly;
• and
• a thermoelectric system integrated with the fan assembly and being operable to actively cool or heat air as the air passes through the fan assembly, the thermoelectric system comprising:
• a thermoelectric heat pump;
• a heat reject subsystem;
• and
• a heat accept subsystem;
• wherein the fan assembly is operable to:
• draw air from a space to be conditioned;
• output conditioned air passed through one of the heat reject subsystem and the heat accept subsystem to the space to be conditioned;
• and
• output air passed through the other one of the heat reject subsystem and the heat accept subsystem away from the space to be conditioned;
• and
• wherein the thermoelectric heat pump comprises:
• a surround and spacer (SAS) structure comprising a wall defining a first open side and a second open side;
• an interconnect board enclosed within the SAS structure, the interconnect board comprising one or more openings from a first surface of the interconnect board to a second surface of the interconnect board, the one or more openings defining locations at which a plurality of thermoelectric modules are to be mounted on the interconnect board;
• the plurality of thermoelectric modules mounted on the interconnect board at the locations defined by the one or more openings, each thermoelectric module of the plurality of thermoelectric modules having a first side and a second side;
• a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module of the plurality of thermoelectric modules;
• and
• a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module of the plurality of thermoelectric modules;
• wherein a periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and a periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that a compression force applied to the heat pump is absorbed by the SAS structure.