Nozzle and substrate processing apparatus using same

A substrate processing apparatus, comprising:

• a process chamber;
• a susceptor provided in the process chamber and configured to hold a substrate on a surface thereof;
• and
• a nozzle including a fluid discharge surface provided so that the fluid discharge surface faces the surface of the susceptor,
• wherein the nozzle includes
• a tubular part including a tubular passage thereinside and a fluid discharge surface having a plurality of fluid discharge holes formed therein along a lengthwise direction of the tubular passage;
• a partition plate provided in the tubular passage and extending along the lengthwise direction so as to vertically partition the tubular passage into a first area including the fluid discharge surface and a second area without the fluid discharge surface, the second area lying immediately above the first area via the partition plate, the partition plate having distribution holes whose number is less than a number of the plurality of fluid discharge holes in the lengthwise direction, the distribution holes and the plurality of fluid discharge holes facing each other;
• and
• a fluid introduction passage in communication with the second area,
• wherein a tip of the tubular part is closed,
• wherein the partition plate is not formed at the tip of the tubular passage, and
• wherein a folded passage to allow the fluid to flow from the second area to the first area by turning is formed at the tip of the tubular passage.