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US 10,472,709 B2Granted
High strength, high conductivity electroformed copper alloys and methods of making
AssigneeApple Inc.
InventorsDaniel T. McDonald, James A. Wright, Wai Man Raymund Kwok
Life of this patent
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Abstract
An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.
Claims18
A binary Cu alloy comprising Cu and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P,
- if X is Mo, Mo ranges from 0.1 wt. % to 2.5 wt. %,
- wherein the binary Cu alloy as-formed has an average grain diameter of less than 100 nm,
- wherein the binary copper alloy has a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS.
The method of claim further comprising:
- separating the binary Cu alloy from the cathode preform.
An electrical connector comprising an electroformed binary CU alloy comprising Cu and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, P,
- is X is Mo, Mo ranges from 0.1 wt. % to 0.5 wt. %.,
- wherein the electroformed binary Cu alloy as-formed has an average grain diameter of less than 100 nm,
- wherein the electroformed binary Cu alloy has a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS.
Dependencies are inferred from the claim text.