Diene/dienophile couples and thermosetting resin compositions having reworkability
AssigneeHenkel IP & Holding GmbH
InventorsTimothy M. Champagne, Laxmisha M. Sridhar, Jonathan B. Israel, Philip T. Klemarczyk, XianMan Zhang, Benny E. Jordan
Life of this patent
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Abstract
Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
Claims8
A curable composition, reaction products of which are controllably degradable upon exposure to a temperature condition greater than a temperature condition used to cure the composition, comprising:
- (a) a curable resin component;
- (b) a curative and
- (c) a diene/dienophile couple functionalized with at least two groups reactive with the curable resin component, wherein the diene/dienophile couple is selected from
- wherein X is CH2, O, S, or NR, wherein R is H, alkyl, aryl or aralkyl;
- Y is O, S or NR, wherein R is H, alkyl, aryl or aralkyl;
- A is alkylene;
- Z is H, (meth)acryloyl, glycidyl or a group containing polymerizable functionality;
- n is 0 or 1;
- and m is 2-4, and isomers thereof, and combinations thereof;
- or
- wherein X1 and X2 are the same or different, and are each independently selected from CH2, O, S, or NR, wherein R is H, alkyl, aryl or aralkyl;
- Y1 and Y2 are the same or different, and are each independently selected from O, S or NR, wherein R is H, alkyl, aryl or aralkyl;
- A1 and A2 are the same or different and are each independently alkylene;
- Z1 and Z2 are the same or different, and are each independently selected from H, (meth)acryloyl, glycidyl or one or more of groups containing polymerizable functionalities;
- and n1 and n2 are the same or different, and are each independently 0 or 1, wherein the curative is selected from one or more of imidazoles, dicyandimide, carboxylic acids, anhydrides, phenolic hardeners, amines, thiols, alcohols, and alkalines.
Dependencies are inferred from the claim text.