Composition for forming laser direct structuring layer, kit, and method for manufacturing resin molded article with plated layer
AssigneeMitsubishi Engineering-Plastics Corporation
InventorsMasahide Sugiyama, Ryusuke Yamada, Tatsuya Kikuchi, Yasushi Yamanaka
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Abstract
Making formation of a plated layer on a surface of a resin molded article possible, without adding the LDS additive to the thermoplastic resin composition. Provided is a composition for forming a laser direct structuring layer, the composition comprising a water-compatible organic substance, water, and a laser direct structuring additive. Further provided is a kit having the composition for forming a laser direct structuring layer and a method for manufacturing a resin molded article with a plated layer, which uses the composition for forming a laser direct structuring layer.
Claims24
A kit, comprising:
- a composition for forming a laser direct structuring layer comprising a water-compatible organic substance, water, and a laser direct structuring additive, and
- a thermoplastic resin composition containing a thermoplastic resin and a glass filler;
- wherein the laser direct structuring additive includes at least one selected from the group consisting of (i) a compound containing copper and chromium, (ii) an oxide containing tin and at least one of antimony and phosphorus, and (iii) an electrically conductive oxide containing at least two species of metals and having a resistivity of 5×103 Ω cm or smaller.
Dependencies are inferred from the claim text.