Prepreg, metal-clad laminate and printed wiring board

A prepreg comprising:

• a woven fabric base;
• and
• a semi-cured product of a resin composition, the semi-cured product filling an inside of the woven fabric base and coating a surface of the woven fabric base, wherein:
• the resin composition includes:
• a thermosetting resin;
• an inorganic filler;
• a first thermoplastic resin soluble in an organic solvent;
• and a second thermoplastic resin insoluble in an organic solvent,
• with respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive,
• a content ratio of the first thermoplastic resin to the second thermoplastic resin is in a range from 30:70 to 70:30, inclusive, expressed by a mass ratio of the first thermoplastic resin to the second thermoplastic resin.