Semiconductor device and image sensor module
AssigneeNamics Corporation
InventorFuminori Arai
Life of this patent
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Abstract
The present invention is intended to provide a semiconductor device including adherends bonded with a cured product of an adhesive, the semiconductor device being configured such that a decrease in bonding strength after curing in a moisture resistance test is suppressed. In this semiconductor device, at least two adherends 20 and 70, 70 and 60, 70 and 50 made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal are bonded with a cured product 10 of an adhesive containing (A) thermosetting resin, (B) a particular thiol compound, and (C) a latent curing agent.
Claims15
A semiconductor device comprising:
- at least two adherends each made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal and bonded with a cured product of an adhesive,
- wherein the adhesive contains
- (A) thermosetting resin,
- (B) a thiol compound represented by a general formula (1):
- where R1 and R2 independently denote hydrogen, an alkyl group with a carbon number of 1 to 10, or a phenyl group and n is an integer of 0 to 10, and
- (C) a latent curing agent, and
- wherein the component (A) is one or more selected from a group consisting of an acrylic acid ester monomer, a methacrylic acid ester monomer, an oligomer of the acrylic acid ester monomer, an oligomer of the methacrylic acid ester monomer and an oligomer of the acrylic acid ester monomer and the methacrylic acid ester monomer, and
- wherein at least one of the adherends is made of the engineering plastic.
An image sensor module comprising a semiconductor device,
- wherein the semiconductor device comprises:
- at least two adherends each made of at least one material selected from the group consisting of engineering plastic, ceramics, and metal and bonded with a cured product of an adhesive,
- wherein the adhesive contains
- (A) thermosetting resin,
- (B) a thiol compound represented by a general formula (1):
- where R1 and R2 independently denote hydrogen, an alkyl group with a carbon number of 1 to 10, or a phenyl group and n is an integer of 0 to 10, and
- (C) a latent curing agent, and
- wherein the component (A) is one or more selected from a group consisting of an acrylic acid ester monomer, a methacrylic acid ester monomer, an oligomer of the acrylic acid ester monomer, an oligomer of the methacrylic acid ester monomer and an oligomer of the acrylic acid ester monomer and the methacrylic acid ester monomer.
Dependencies are inferred from the claim text.