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US 10,472,231 B2Granted
Assembly and packaging of MEMS device
AssigneeInvenSense, Inc.
InventorsBrian H. Kim, Haijun She, Mozafar Maghsoudnia
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Abstract
A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
Claims8
A method of manufacturing a Micro Electro Mechanical systems (MEMS) device comprising:
- bonding a plurality of solder bumps on a substrate of a wafer;
- dicing a CMOS-MEMS wafer to separate a plurality of CMOS-MEMS die, the plurality of CMOS-MEMS die including a MEMS die, a CMOS die, and a plurality of stud bumps,
- wherein the plurality of stud bumps is attached to the CMOS die;
- cleaning the plurality of stud bumps;
- positioning the plurality of CMOS-MEMS die on top of the substrate;
- heating the positioned CMOS-MEMS die thereby causing a reflow and connection between the CMOS die and the substrate through the plurality of stud bumps and the plurality of solder bumps;
- underfilling a space disposed between the CMOS die and the substrate;
- curing the underfilled die;
- and
- singulating the substrate.
7 more elements
Dependencies are inferred from the claim text.