MEMS device package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChien-Hua Chen, Cheng-Yuan Kung, Che-Hau Huang, Chin-Cheng Kuo
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Abstract
A Micro Electro-Mechanical System (MEMS) device package includes a first circuit layer, a partition wall, a MEMS component, a second circuit layer and a polymeric dielectric layer. The partition wall is disposed over the first circuit layer. The MEMS component is disposed over the partition wall and electrically connected to the first circuit layer. The first circuit layer, the partition wall and the MEMS component enclose a space. The second circuit layer is disposed over and electrically connected to the first circuit layer. The polymeric dielectric layer is disposed between the first circuit layer and the second circuit layer.
Claims20
A Micro Electro-Mechanical System (MEMS) device package, comprising:
- a first circuit layer;
- a partition wall disposed over the first circuit layer;
- a MEMS component disposed over the partition wall and electrically connected to the first circuit layer, wherein the first circuit layer, the partition wall and the MEMS component enclose a space;
- a second circuit layer disposed over and electrically connected to the first circuit layer;
- and
- a polymeric dielectric layer disposed between the first circuit layer and the second circuit layer, wherein the polymeric dielectric layer is separated from the space by the partition wall.
A Micro Electro-Mechanical System (MEMS) device package, comprising:
- a first circuit layer;
- a MEMS component disposed over the first circuit layer, wherein the first circuit layer and the MEMS component define a space in between;
- a partition wall disposed over the first circuit layer and adjacent to the MEMS component;
- and
- a polymeric dielectric layer disposed over the first circuit layer, and separated from the space by the partition wall.
Dependencies are inferred from the claim text.