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US 10,471,714 B2Granted
Printhead
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie
Life of this patent
Estimating the term…
Abstract
A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.
Claims20
A printhead comprising:
- a number of inkjet slivers overmolded into a moldable substrate, the overmolded inkjet slivers forming at least one printhead die, and wherein the moldable substrate is an epoxy molding compound (EMC) including an epoxide;
- and
- a number of wire bonds electrically coupling the overmolded inkjet slivers to a side connector, the side connector to electrically couple the overmolded inkjet slivers to a controller of a printing device.
A printhead die comprising:
- a moldable substrate;
- a number of inkjet slivers overmolded into the moldable substrate;
- and
- a number of electrical wire leads connecting the overmolded inkjet slivers to an edge connector coupled to the moldable substrate, the moldable substrate is an epoxy mold compound (EMC) including an epoxide.
1 more element
A method of manufacturing a printhead comprising:
- overmolding a number of inkjet slivers into a moldable substrate, the overmolded inkjet slivers forming at least one printhead die and the moldable substrate is an epoxy mold compound (EMC) including an epoxide;
- electrically coupling a first end of a number of wire bonds to the overmolded inkjet slivers;
- and
- electrically coupling a second end of the wire bonds to a side connector coupled to an edge of the printhead.
1 more element
Dependencies are inferred from the claim text.