Adhesive composition and laminate with adhesive layer using same

An adhesive composition, which comprises a modified polyolefin-based resin (A), an epoxy resin (B), and a curing accelerator, wherein

• the modified polyolefin-based resin (A) is a resin resulting from graft-modification of an unmodified polyolefin resin with a modifying agent comprising an α,β-unsaturated carboxylic acid or derivative thereof,
• the content of the modified polyolefin-based resin (A) is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition,
• the modified polyolefin-based resin (A) has a weight average molecular weight of from 30,000 to 250,000,
• the modified polyolefin-based resin (A) has an acid value of from 0.1 to 50 mg KOH/ g,
• the epoxy resin (B) is an epoxy resin having no glycidylamino group,
• the content of the epoxy resin (B) is 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin,
• the curing accelerator is at least one selected from the group consisting of a tertiary amine-based curing accelerator, a tertiary amine salt based curing accelerator, and an imidazole based curing accelerator, and
• the adhesive composition exhibits a dielectric constant lower than 2.5 as measured at a frequency of 1 GHz when made into a cured body.