Bonding preparation patch

#The subject matter disclosed herein relates to a bonding patch for providing a matte surface and, more particularly, to a bonding patch and method for using a bonding patch for an attachment to a treated surface of aircraft components.

#Current airframe fabrication techniques involve the successive layering of laminates, which include carbon and fiberglass such as Aramid (Kevlar™), and which are bonded to one another by resins. When the laminates are coated with the resin, which is liquid and sticky in its uncured form, and heated, a strong bond between the laminates is achieved with the resin coated surface forming a non-sticky generally smooth surface.

#In the particular instance wherein the laminates are bonded to form an airframe, such as that of an airplane or helicopter, there exists the further need to attach infrastructure to the sides of the airframe including the hardened laminate structures. For example, it is common to run electrical wiring around and along the surface structure of an airframe and to bond clips or other holding devices to the surface of the airframe through which a continuous electrical network may be run. However, in order to bond a clip or other holding device to the relatively smooth surface of the heat treated resin coated laminate, it is necessary to treat the surface so as to form a matte or otherwise non-smooth, abrasive surface in order to enhance the bonding ability of whatever glue or bonding material is used to attach the clip or other holding device to the epoxy resin coated surface.

#The subject matter, which is regarded as the invention, is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:

#FIG. 1A is a side view of a bonding preparation patch in accordance with embodiments;

#FIG. 1B is a top down view of a portion of the bonding preparation patch of FIG. 1;

#The detailed description explains embodiments of the invention, together with advantages and features, by way of example with reference to the drawings.

#As will be described below, a bonding preparation patch is provided and is formed of a strip of porous, woven material that is folded to form a flap with the non-flap portion laid generally flat against a resin surface. As a result, the resin soaks into, and partially through, the portion of the material laid flat against the resin. A barrier is provided to separate the flap and non-flap portions of the material which serves to prevent the resin from soaking through to the flap portion. The flap is then pressed flat and secured through the use of tape.

#Once the resin is heat treated to become non-sticky, the tape may be removed exposing the flap portion of the material. By pulling on the flap, the non-flap portion of the material may be separated from the underlying resin treated surface. With the strip removed, the area of contact between the material and the resin treated surface exhibits a matte surface owing to the surface characteristics of the material which has been imprinted upon the resin treated surface. Such a bonding preparation patch may be distributed at any place about a resin treated surface and left in place until the resin treated surface has been assembled into an airframe or other structure.