CMP pad conditioning assembly
AssigneeEntegris, Inc.
InventorsPatrick Doering, Rajesh Tiwari, Andrew Galpin
Life of this patent
Estimating the term…
Abstract
A chemical mechanical planarization (CMP) pad conditioning assembly that includes one or more support structures positioned between one or more abrasive regions of the pad conditioning assembly is disclosed. The support structures and abrasive regions can be separated by one or more channels. A top surface of the one or more support structures is not co-planar with the top surface of the abrasive regions of the pad conditioning assembly, and the height of the top surface of the one or more support structures when measured to the pad facing surface of the pad conditioning assembly backing plate is less than the height of the top surfaces of the abrasive regions when measured to the pad facing surface of the pad conditioning assembly.
Claims13
A CMP pad conditioning assembly comprising:
- a backing plate that has a first face and a second face, said backing plate includes a mounting structure on the second face;
- said mounting structure secures the backing plate to a chemical mechanical planarization tool;
- one or more abrasive regions on the first face of said backing plate that comprise one or more protrusions, tops of said protrusions reside in a first plane that has a first average height measured from the first face of the backing plate;
- a single supporting structure on the first face of said backing plate and at least partially covering a central region of said backing plate, said single supporting structure comprising a plurality of supporting segments positioned between said abrasive regions and separated from said abrasive regions, said single supporting structure having a top surface, the top surface of said single supporting structure residing in a second plane that has a second average height measured from the first face of the backing plate, wherein the first average height of the first plane is greater than the second average height of the second plane;
- and
- one or more channels positioned between one or more of the supporting segments of the single supporting structure and the one or more abrasive regions, the one or more channels having a length and configured to allow flow of CMP pad debris, slurry or liquid away from the CMP pad conditioning assembly along its length.
A CMP pad conditioning assembly comprising:
- a backing plate that has a first face and a second face, said backing plate includes a mounting structure on the second face;
- said mounting structure secures the backing plate to a chemical mechanical planarization tool;
- one or more abrasive regions on the first face of said backing plate that comprise one or more protrusions, tops of said protrusions reside in a first plane that has a first average height measured from the first face of the backing plate;
- a single supporting structure on the first face of said backing plate and at least partially covering a central region of said backing plate, said single supporting structure comprising a plurality of supporting segments positioned between said abrasive regions and separated from said abrasive regions, said single supporting structure having a top surface, the top surface of said single supporting structure residing in a second plane that has a second average height measured from the first face of the backing plate, wherein the first average height of the first plane is greater than the second average height of the second plane;
- and
- one or more channels positioned between one or more of the supporting segments of the single supporting structure and the one or more abrasive regions, the one or more channels having parallel sidewalls configured to allow flow of CMP pad debris, slurry or liquid away from the CMP pad conditioning assembly.
Dependencies are inferred from the claim text.