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US 10,471,545 B2Granted
Top-side laser for direct transfer of semiconductor devices
AssigneeRohinni, LLC
InventorsJustin Wendt, Andrew Huska, Cody Peterson
Life of this patent
Estimating the term…
Abstract
An apparatus includes a needle including a hole extending from a first end to a second end through the needle and an energy-emitting device arranged in the hole of the needle. The energy-emitting device being configured to emit a specific wavelength and intensity of energy directed at an electrically-actuatable element to bond a circuit trace and the electrically-actuatable element.
Claims16
An apparatus configured to transfer an electrically-actuatable element directly from a first side of a wafer tape to a product substrate having a circuit trace thereon, the apparatus comprising:
- a needle disposed adjacent a second side of the wafer tape opposite the first side of the wafer tape, the needle including a first end opposite a second end and a hole extending from the first end to the second end through the needle;
- a needle actuator to move the needle to a position at which the second end of the needle presses on the second side of the wafer tape to press the electrically-actuatable element into contact with the circuit trace disposed adjacent the first side of the product substrate;
- a clamp connected to an end of the needle actuator and slideably housing the first end of the needle, the clamp having a hole extending through a side of the clamp toward a center of the clamp transversely to the hole of the needle;
- and
- an energy-emitting device arranged in the hole of the needle and extending through the hole of the clamp, the energy-emitting device being configured to emit a specific wavelength and intensity of energy directed at the electrically-actuatable element when the second end of the needle presses the electrically-actuatable element into contact with the circuit trace to bond the circuit trace and the electrically-actuatable element.
2 more elements
An apparatus comprising:
- a wafer tape frame configured to hold a wafer tape having a first side and a second side, a semiconductor device die being disposed on the first side of the wafer tape;
- a product substrate holder frame including a first portion and a second portion to clamp to a product substrate having a circuit trace thereon such that the circuit trace is disposed facing the semiconductor device die on the wafer tape;
- a needle disposed adjacent the wafer tape frame, the needle including a first end opposite a second end, and a hole extending from the first end to the second end through the needle;
- a needle actuator connected to first end of the needle to move the needle to a die transfer position at which the second end of the needle presses on the second side of the wafer tape to press the semiconductor device die into contact with the circuit trace;
- and
- an energy-emitting device arranged in the hole of the needle, the energy-emitting device being configured to emit a specific wavelength and intensity of energy directed at the semiconductor device die when the second end of the needle presses the semiconductor device die into contact with the circuit trace to bond the circuit trace and the semiconductor device die.
3 more elements
An apparatus comprising:
- a needle having a first end opposite a second end, and a hole extending from the first end to the second end through the needle;
- a needle actuator to move the needle to a position at which the second end of the needle presses an electrically-actuatable element into contact with a circuit trace;
- a clamp connected to an end of the needle actuator and slideably housing the first end of the needle, the clamp having a hole extending through a side of the clamp toward a center of the clamp transversely to the hole of the needle;
- and
- an energy-emitting device arranged in the hole of the needle and extending through the hole of the clamp, the energy-emitting device being configured to emit a specific wavelength and intensity of energy directed at the electrically-actuatable element when the second end of the needle presses the electrically-actuatable element into contact with the circuit trace to bond the circuit trace and the electrically-actuatable element.
2 more elements
Dependencies are inferred from the claim text.