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US 10,468,383 B2Granted
Semiconductor device and manufacturing method thereof
OwnerMakoto Shizukuishiinventor
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes n semiconductor chips stacked via electrical contacting means in the silicon substrate thickness direction, n being an integer larger than 2, a side face of the stacked semiconductor device in the substrate thickness direction being covered by a non-conductive layer. The shape of the side face with respect to a plan view of the stacked semiconductor device may be one of curved, convex, concave or circular.
Claims13
A semiconductor device comprising:
- a stacked structure including a plurality of semiconductor chips stacked successively in a first direction that is parallel to a Z-axis, the plurality of semiconductor chips being electrically connected to each other through electrical contacts located in between adjacent pairs of semiconductor chips among the plurality of semiconductor chips,
- each of the plurality of semiconductor chips including,
- a top surface that is parallel to an X-Y plane defined by an X-axis and a Y-axis,
- a bottom surface that is opposite the top surface and parallel to the X-Y plane, and
- a plurality of side surfaces that are parallel to the Z-axis, the plurality of side surfaces including,
- a first side surface that includes a continuous curve with respect to the X-Y plane, and
- second through fourth side surfaces,
- a length of the continuous curve being greater than half an entire length of the first side surface with respect to the X-Y plane,
- the stacked structure having a 4-sided footprint with respect to the X-Y plane,
- the 4-sided footprint being defined by the first through fourth side surfaces of each of the plurality of semiconductor chips.
7 more elements
A semiconductor device comprising:
- a stacked structure including a plurality of semiconductor chips stacked successively in a first direction that is parallel to a Z-axis, the plurality of semiconductor chips being electrically connected to each other through electrical contacts located in between adjacent pairs of semiconductor chips among the plurality of semiconductor chips,
- each of the plurality of semiconductor chips including,
- a top surface that is parallel to an X-Y plane defined by an X-axis and a Y-axis,
- a bottom surface that is opposite the top surface and parallel to the X-Y plane, and
- a plurality of side surfaces that are parallel to the Z-axis, the plurality of side surfaces including,
- a first side surface that is curved with respect to the X-Y plane, and
- second through fourth side surfaces,
- the stacked structure having a 4-sided footprint with respect to the X-Y plane,
- the 4-sided footprint being defined by the first through fourth side surfaces of each of the plurality of semiconductor chips,
- wherein one or more semiconductor chips from among the plurality of semiconductor chips further include opt-electrical conversion regions that extend inward from the curved first side surfaces of the one or more semiconductor chips in a direction parallel to the top surfaces of the one or more semiconductor chips.
7 more elements
A semiconductor module comprising:
- a plurality of first semiconductor devices,
- wherein, each first semiconductor device, from among the plurality of first semiconductor device, comprises:
- a stacked structure including a plurality of semiconductor chips stacked successively in a first direction that is parallel to a Z-axis, the plurality of semiconductor chips being electrically connected to each other through electrical contacts located in between adjacent pairs of semiconductor chips among the plurality of semiconductor chips,
- each of the plurality of semiconductor chips including,
- a top surface that is parallel to an X-Y plane defined by an X-axis and a Y-axis,
- a bottom surface that is opposite the top surface and parallel to the X-Y plane, and
- a plurality of side surfaces that are parallel to the Z-axis, the plurality of side surfaces including,
- a first side surface that is curved with respect to the X-Y plane, and
- second through fourth side surfaces,
- the stacked structure having a 4-sided footprint with respect to the X-Y plane,
- the 4-sided footprint being defined by the first through fourth side surfaces of each of the plurality of semiconductor chips, and
- wherein the plurality of first semiconductor devices are arranged adjacent to each other such that the curved first side surfaces of the plurality of first semiconductor devices form a substantially circular surface.
9 more elements
A semiconductor device comprising:
- a stacked structure including a plurality of semiconductor chips stacked successively in a first direction that is parallel to a Z-axis, the plurality of semiconductor chips being electrically connected to each other through electrical contacts located in between adjacent pairs of semiconductor chips among the plurality of semiconductor chips,
- each of the plurality of semiconductor chips including,
- a top surface that is parallel to an X-Y plane defined by an X-axis and a Y-axis,
- a bottom surface that is opposite the top surface and parallel to the X-Y plane, and
- a plurality of side surfaces that are parallel to the Z-axis, the plurality of side surfaces including,
- a first side surface that is curved with respect to the X-Y plane, and
- second through fourth side surfaces,
- the stacked structure having a 4-sided footprint with respect to the X-Y plane,
- the 4-sided footprint being defined by the first through fourth side surfaces of each of the plurality of semiconductor chips,
- wherein the curved first side surfaces of the plurality of semiconductor chips are convex with respect to the X-Y plane.
7 more elements
Dependencies are inferred from the claim text.