EMI Shielding structure in InFO package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKai-Chiang Wu, Chen-Hua Yu, Ching-Feng Yang, Meng-Tse Chen
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Abstract
A method includes forming a metal post over a first dielectric layer, attaching a second dielectric layer over the first dielectric layer, encapsulating a device die, the second dielectric layer, a shielding structure, and the metal post in an encapsulating material, planarizing the encapsulating material to reveal the device die, the shielding structure, and the metal post, and forming an antenna electrically coupling to the device die. The antenna has a portion vertically aligned to a portion of the device die.
Claims20
A method comprising:
- forming a metal post over a first dielectric layer;
- attaching a second dielectric layer over the first dielectric layer;
- encapsulating a device die, the second dielectric layer, a shielding structure, and the metal post in an encapsulating material;
- planarizing the encapsulating material to reveal the device die, the shielding structure, and the metal post;
- and
- forming a first antenna electrically coupling to the device die, wherein the first antenna has a portion vertically aligned to a portion of the device die.
A method comprising:
- forming a first dielectric layer over a carrier;
- attaching a second dielectric layer to the first dielectric layer;
- disposing a metal film over the second dielectric layer;
- forming a side-shielding structure over the metal film;
- attaching a device die to the metal film, wherein the device die is in a region encircled by the side-shielding structure;
- encapsulating the device die and the side-shielding structure in an encapsulating material;
- and
- forming a first antenna, wherein the first antenna and the device die are on opposite sides of the second dielectric layer, and the first antenna is electrically coupled to the device die.
A method comprising:
- attaching a pre-formed dielectric layer over a carrier;
- disposing a metal film over the pre-formed dielectric layer;
- forming a side-shielding structure over and electrically coupling to the metal film, wherein the side-shielding structure forms a ring;
- placing a device die in a region over the metal film, wherein the device die is encircled by the ring formed of the side-shielding structure;
- encapsulating the device die and the side-shielding structure in an encapsulating material;
- de-mounting the pre-formed dielectric layer, the device die, the metal film, and the side-shielding structure from the carrier;
- and
- forming a first antenna, wherein the first antenna and the device die are on opposite sides of the pre-formed dielectric layer.
Dependencies are inferred from the claim text.