Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board
AssigneeHitachi Chemical Company, Ltd.
InventorsKouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi Chemical Company, Ltd.
InventorsKouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai
Estimating the term…
The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes.
A production method for producing a varnish, comprising reacting a compound having an amino group and a resin having a plurality of epoxy groups, and having at least one polycyclic structure selected from the group consisting of a structure formed through condensation of aromatic rings, a biphenyl novolak structure, or a terphenyl structure, wherein a portion of the plurality of the epoxy groups of the resin is caused to react with the amino group of the compound in an organic solvent, to form a reaction product having a weight average molecular weight in the range of 800 to 4000.
A production method for producing a varnish, comprising reacting a compound having a phenolic hydroxyl group and a resin having a plurality of epoxy groups, and having at least one polycyclic structure selected from the group consisting of a structure formed through condensation of aromatic rings, a biphenyl novolak structure, or a terphenyl structure, wherein a portion of the plurality of the epoxy groups of the resin is caused to react with the phenolic hydroxyl group of the compound in an organic solvent to form a reaction product having a weight average molecular weight in the range of 800 to 4000.
Dependencies are inferred from the claim text.