Cell cutting device for display devices
AssigneeSamsung Display Co., Ltd.
InventorsKyung-Hoe Heo, Seung-Jun Lee
Life of this patent
Estimating the term…
Abstract
A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.
Claims18
A cell cutting device for cutting a mother substrate for display devices that includes a plurality of cells, the cell cutting device comprising:
- a fixing unit configured to have the mother substrate fixed thereto during a cutting process, and configured to move the mother substrate in a first direction during the cutting process;
- a cutter configured to cut the mother substrate in a second direction that is a cutting direction of the mother substrate, the cutter facing a first surface of the mother substrate during the cutting process;
- a cutter driving unit fixed to the cutter, the cutter driving unit being configured to drive the cutter during the cutting process;
- a buffer member arranged facing a second surface of the mother substrate, opposite the first surface, the buffer member being positioned to correspond to the cutter during the cutting process;
- and
- a support member arranged on an opposite side of the buffer member from the second surface of the mother substrate such that the buffer member is interposed between the second surface of the mother substrate and the support member during the cutting process, wherein:
- a portion of the support member that faces the buffer member has a width in the first direction that is smaller than a width of the mother substrate in the first direction, and
- the buffer member has a width in the cutting direction that is equal to or greater than a width of the cutter in the cutting direction.
Dependencies are inferred from the claim text.