# US 10,455,748 B2 · High-frequency module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,748 B2 - Document ID: US10455748B2 - Status: Granted - Kind: B2 - Application number: 15/817,481 - Filed: 2017-11-20 - Published: 2018-03-15 - Granted: 2019-10-22 - Earliest claimed: 2015-05-20 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Issei Yamamoto - Web page: https://patentgrep.com/patent/US10455748B2 ## CPC - H05K 9/0088: {comprising a plurality of shielding layers; combining different shielding material structure} - B32B 3/08: characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)} - B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 9/005: {comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} - B32B 9/045: {of synthetic resin} - B32B 15/08: of synthetic resin - B32B 27/08: of synthetic resin - B32B 27/38: comprising epoxy resins - C23C 14/185: {by cathodic sputtering} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/181: associated with surface mounted components - H05K 5/065: {sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding} - H05K 9/0022: {of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20)} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/00: Package configurations - H10W 99/00: Subject matter not provided for in other groups of this subclass - B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer - B32B 2255/205: Metallic coating - B32B 2255/28: Multiple coating on one surface - B32B 2307/20: having particular electrical or magnetic properties, e.g. piezoelectric - B32B 2307/202: Conductive - B32B 2307/538: Roughness - B32B 2307/752: Corrosion inhibitor - B32B 2457/00: Electrical equipment - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/10522: Adjacent components - H05K 2201/10545: Related components mounted on both sides of the PCB - H05K 2203/1316: Moulded encapsulation of mounted components - H05K 2203/1327: Moulding over PCB locally or completely - H10P 14/412: {Deposition of metallic or metal-silicide materials} - H10W 74/016: {using moulds} - H10W 74/10: characterised by their shape or disposition - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness. ## Claims ### Claim 1 A high-frequency module comprising: a wiring board; a first component mounted on a first principal surface of the wiring board; a first sealing resin layer laminated on the first principal surface of the wiring board and sealing the first component; and shield layers laminated on the first sealing resin layer, wherein the shield layers include a first shield layer laminated on the first sealing resin layer so as to cover an opposite surface of the first sealing resin layer and a peripheral side surface of the first sealing resin layer, the opposite surface being opposite to the first principal surface of the wiring board, and a second shield layer laminated on a portion of the first shield layer that covers the peripheral side surface of the first sealing resin layer; wherein, of the first and second shield layers, the first shield layer is exposed at a surface of a portion covering the opposite surface of the first sealing resin layer. ### Claim 2 (depends on 1) The high-frequency module according to claim 1, wherein the first shield layer includes a first conductive film made of a metal, and wherein the second shield layer includes a second conductive film made of a metal, wherein the metal of the second conductive film is the same as the metal of the first conductive film. ### Claim 3 (depends on 1) The high-frequency module according to claim 1, wherein the first shield layer includes a first conductive film made of a metal, wherein the second shield layer includes a third conductive film made of a metal, wherein the metal of the third conductive film differs from the metal of the first conductive film, and wherein one of the metal of the first conductive film and the metal of the third conductive film has a relative permeability greater than or equal to 1. ### Claim 4 (depends on 1) The high-frequency module according to claim 1, further comprising: a second component mounted on a second principal surface of the wiring board; and a second sealing resin layer laminated on the second principal surface of the wiring board and sealing the second component, wherein the first shield layer further covers a peripheral side surface of the second sealing resin layer, and wherein, in addition to the portion of the first shield layer covering the peripheral side surface of the first sealing resin layer, the second shield layer is provided so as to cover a portion of the first shield layer covering the peripheral side surface of the second sealing resin layer and an opposite surface of the second sealing resin layer opposite to the second principal surface of the wiring board. ### Claim 5 (depends on 2) The high-frequency module according to claim 2, further comprising: a second component mounted on a second principal surface of the wiring board; and a second sealing resin layer laminated on the second principal surface of the wiring board and sealing the second component, wherein the first shield layer further covers a peripheral side surface of the second sealing resin layer, and wherein, in addition to the portion of the first shield layer covering the peripheral side surface of the first sealing resin layer, the second shield layer is provided so as to cover a portion of the first shield layer covering the peripheral side surface of the second sealing resin layer and an opposite surface of the second sealing resin layer opposite to the second principal surface of the wiring board. ### Claim 6 (depends on 3) The high-frequency module according to claim 3, further comprising: a second component mounted on a second principal surface of the wiring board; and a second sealing resin layer laminated on the second principal surface of the wiring board and sealing the second component, wherein the first shield layer further covers a peripheral side surface of the second sealing resin layer, and wherein, in addition to the portion of the first shield layer covering the peripheral side surface of the first sealing resin layer, the second shield layer is provided so as to cover a portion of the first shield layer covering the peripheral side surface of the second sealing resin layer and an opposite surface of the second sealing resin layer opposite to the second principal surface of the wiring board. ### Claim 7 A high-frequency module comprising: a wiring board; a first component mounted on a first principal surface of the wiring board; a first sealing resin layer laminated on the first principal surface of the wiring board and sealing the first component; and a third shield layer laminated on the first sealing resin layer so as to cover an opposite surface of the first sealing resin layer and a peripheral side surface of the first sealing resin layer, the opposite surface being opposite to the first principal surface of the wiring board, wherein the third shield layer includes an adhesion film laminated on the first sealing resin layer and a conductive film laminated on the adhesion film, and wherein a ratio of a thickness of the adhesion film on a side of the peripheral side surface to a thickness of the adhesion film on a side of the opposite surface is smaller than a ratio of a thickness of the conductive film on the side of the peripheral side surface to a thickness of the conductive film on the side of the opposite surface.