# US 10,455,740 B1 · Electronic chassis with heat exchanger > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,740 B1 - Document ID: US10455740B1 - Status: Granted - Kind: B1 - Application number: 16/040,091 - Filed: 2018-07-19 - Granted: 2019-10-22 - Earliest claimed: 2018-07-19 - Assignees: GE Aviation Systems LLC - Applicants: Ge Aviation Systems LLC - Inventors: Michel Engelhardt; Ning Liu - Web page: https://patentgrep.com/patent/US10455740B1 ## CPC - H05K 7/20545: {Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards} - H05K 7/206: {Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger} - B64D 13/06: the air being conditioned (pressurising B64D13/02) - H05K 7/1412: {hold down mechanisms, e.g. avionic racks} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 7/20572: {within cabinets for removing heat from sub-racks, e.g. plenum} - B64D 2013/0614: {with subsystems for cooling avionics} - B64D 2013/0618: {with arrangements for reducing or managing bleed air, using another air source, e.g. ram air} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B64D: EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT ## Abstract Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger. The air-to-air heat exchanger can include an air flow inlet and various slots to establish a flow-through air path. ## Claims ### Claim 1 An electronics chassis comprising: an electronics housing defining a space for at least one electronic component; an air-to-air heat exchanger thermally coupled to at least a portion of the electronics housing and having a flow-through air path; and a plenum coupled to the housing and defining a plenum chamber that is fluidly isolated from the space and fluidly coupled to the flow-through air path, the plenum having an air flow inlet and at least one entrainment slot, which are fluidly coupled to the plenum chamber, the air flow inlet has a diameter D and the at least one entrainment slot is spaced from the electronics housing a distance of at least half of the diameter or D/2. ### Claim 2 (depends on 1) The electronics chassis of claim 1 wherein the electronics housing has a first wall and the plenum overlies a portion of the first wall. ### Claim 3 (depends on 2) The electronics chassis of claim 2 wherein the electronics housing has a second wall and the air-to-air heat exchanger overlies at least a portion of the second wall. ### Claim 4 (depends on 3) The electronics chassis of claim 3 wherein the first and second walls define a junction. ### Claim 5 (depends on 4) The electronics chassis of claim 4 wherein the first wall is a back wall and the second wall is a side wall. ### Claim 6 (depends on 5) The electronics chassis of claim 5 comprising a second air-to-air heat exchanger on a second side wall opposing the second wall. ### Claim 7 (depends on 5) The electronic chassis of claim 5 wherein the electronics housing comprises a back plane forming the back wall. ### Claim 8 (depends on 1) The electronics chassis of claim 1 wherein the at least one entrainment slot comprises multiple entrainment slots. ### Claim 9 (depends on 8) The electronics chassis of claim 8 wherein the multiple entrainment slots are spaced about the air flow inlet. ### Claim 10 (depends on 1) The electronics chassis of claim 1 wherein the at least one entrainment slot is spaced from the air flow inlet a predetermined distance. ### Claim 11 (depends on 1) The electronics chassis of claim 1 wherein the entrainment slot has a length greater than a local thickness of the plenum where the entrainment slot is located. ### Claim 12 (depends on 1) The electronics chassis of claim 1 wherein the entrainment slot has a hydraulic diameter d that is no greater than ten percent of the diameter or 0.1 D. ### Claim 13 (depends on 1) The electronics chassis of claim 1 wherein the entrainment slot has a slot angle defined from a normal line perpendicular to the plenum at an inlet edge to a center line of the entrainment slot, wherein the slot angle is at least 45 degrees. ### Claim 14 (depends on 1) The electronics chassis of claim 1 wherein the air-to-air heat exchanger comprises multiple fins within the flow-through air path. ### Claim 15 An electronics chassis comprising: an electronics housing defining an space for at least one electronic component; an air-to-air heat exchanger thermally coupled to at least a portion of the electronics housing and having a flow-through air path; and a plenum coupled to the housing and defining a plenum chamber that is fluidly isolated from the space and fluidly coupled to the flow-through air path, the plenum having an air flow inlet fluidly coupled to the plenum chamber and having a diameter D, and at least one entrainment slot fluidly coupled to the plenum chamber, wherein the entrainment slot: is spaced from the electronics housing a distance of at least half the diameter or D/2, has a length greater than a local thickness of the plenum where the entrainment slot is located, has a hydraulic diameter d that is no greater than ten percent of the diameter or 0.1 D, and has a slot angle defined from a normal line perpendicular to the plenum at an inlet edge to a center line of the entrainment slot, wherein the slot angle is at least 45 degrees. ### Claim 16 (depends on 15) The electronics chassis of claim 15 wherein the electronics housing comprises a back wall and two opposing side walls extending from the back wall, with the heat exchanger overlying a portion of each of the opposing side walls, and the plenum overlying the back wall. ### Claim 17 (depends on 16) The electronics chassis of claim 16 wherein the at least one entrainment slot comprises multiple entrainment slots. ### Claim 18 (depends on 17) The electronics chassis of claim 17 wherein the multiple entrainment slots are spaced about the air flow inlet. ### Claim 19 (depends on 18) The electronics chassis of claim 18 wherein the air-to-air heat exchanger comprises multiple fins within the flow-through air path. ### Claim 20 (depends on 19) The electronics chassis of claim 19 wherein the electronics housing comprises a back plane forming the back wall.