# US 10,455,731 B2 · Hydraulic bladder for CPU interconnection and cooling > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,731 B2 - Document ID: US10455731B2 - Status: Granted - Kind: B2 - Application number: 15/457,446 - Filed: 2017-03-13 - Published: 2018-09-13 - Granted: 2019-10-22 - Earliest claimed: 2017-03-13 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Ralph W. Jensen; Jeffory L. Smalley; Kevin J. Ceurter; Devdatta P. Kulkarni; Casey Winkel - Web page: https://patentgrep.com/patent/US10455731B2 ## CPC - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - G06F 1/20: Cooling means - H05K 7/20772: {within server blades for removing heat from heat source} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 90/00: Package configurations - G06F 2200/201: Cooling arrangements using cooling fluid - H10W 40/611: {Bolts or screws} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed. ## Claims ### Claim 1 A hydraulic force generator comprising: a first block to be coupled with a system board; a second block, and a third block; and a hydraulic bladder having a first region and a second region, wherein the first region is disposed between the first block and the second block to provide a force against a first integrated circuit (IC) package to be positioned between the second block and a system board; wherein the second region is disposed between the first block and the third block to provide a force against a second IC package to be positioned between the third block and the system board; and wherein the hydraulic bladder, in response to pressurization, is to provide a force against the first IC package and the second IC package located between the hydraulic bladder and the system board. ### Claim 2 (depends on 1) The hydraulic force generator of claim 1, wherein the hydraulic bladder includes a first metal skin, a second metal skin coupled to the first metal skin, and a hydraulic fitting. ### Claim 3 (depends on 2) The hydraulic force generator of claim 2, wherein one or more of the first metal skin and the second metal skin are formed of stainless steel, copper, or aluminum. ### Claim 4 (depends on 2) The hydraulic force generator of claim 2, wherein the hydraulic fitting is a first hydraulic fitting and the hydraulic bladder includes a second hydraulic fitting, wherein the first hydraulic fitting and the second hydraulic fitting are to be coupled to a pressurized liquid cooling system. ### Claim 5 (depends on 4) The hydraulic force generator of claim 4, wherein the hydraulic bladder includes a flexible heat conductive material inside the hydraulic bladder. ### Claim 6 (depends on 5) The hydraulic force generator of claim 5, wherein the flexible heat conductive material includes metallic foam, metallic foil, metallic gauze, or metallic felt. ### Claim 7 (depends on 6) The hydraulic force generator of claim 6, wherein the flexible heat conductive material includes metallic foil having serpentine pattern fins. ### Claim 8 (depends on 2) The hydraulic force generator of claim 2, wherein one or more of the first metal skin and the second metal skin have a thickness less than or equal to approximately 0.005 inches. ### Claim 9 (depends on 1) The hydraulic force generator of claim 1, wherein the first block is to be located on a first side of the system board and the hydraulic force generator further comprises a bolster plate to be located on a second side of the system board opposite the first side of the system board, wherein the first block is to be fastened to the bolster plate through the system board. ### Claim 10 A computer system comprising: a first system board and a second system board; a first socket coupled with the first system board and a second socket coupled with the second system board; a first integrated circuit (IC) package having a plurality of interconnects coupled with the first socket and a second IC package having a plurality of interconnects coupled with the second socket; a first hydraulic bladder to provide a force against a first side of the first IC package such that a compressive force is maintained between a second side of the IC package and the first socket; and a second hydraulic bladder to provide a force against a first side of the second IC package such that a compressive force is maintained between a second side of the second IC package and the second socket, wherein the second hydraulic bladder is between the second IC package and a second side of the first system board opposite the first side of the first system board. ### Claim 11 (depends on 10) The computer system of claim 10, further comprising a block, wherein the first or second hydraulic bladder is to be located between the IC package and a first or a second block. ### Claim 12 (depends on 11) The computer system of claim 11, wherein the first or second socket is on a first side of the first or second system board and the computer system further comprises a bolster plate on a second side of the first or second system board, wherein the first or second block is to be fastened to the bolster plate through the first or second system board. ### Claim 13 (depends on 11) The computer system of claim 11, further comprising a heat spreader plate having a cavity, wherein the first or second IC package includes an IC die located within the cavity. ### Claim 14 (depends on 13) The computer system of claim 13, wherein the IC die is a first IC die, the cavity is a first cavity, the heat spreader plate includes a second cavity, and the IC package includes a third IC die located within the second cavity. ### Claim 15 (depends on 14) The computer system of claim 14, wherein the first IC die has a first height orthogonal to a plane of the first or second system board, a second IC die has a second height orthogonal to the plane of the first or second system board, and wherein the first height is different than the second height. ### Claim 16 (depends on 15) The computer system of claim 15, wherein the heat spreader plate has a first thickness in a first region around the first cavity and a second thickness in a second region around the second cavity, wherein the first thickness is different than the second thickness, wherein the first or second hydraulic bladder includes a first hydraulic fitting and a second hydraulic fitting, wherein the first hydraulic fitting and the second hydraulic fitting are to be coupled to a pressurized liquid cooling system, and wherein the hydraulic bladder includes a flexible heat conductive material inside the hydraulic bladder that includes metallic foam, metallic foil, metallic gauze, or metallic felt. ### Claim 17 (depends on 10) The computer system of claim 10, further comprising one or more additional system boards, one or more additional sockets, one or more additional IC packages, and one or more additional hydraulic bladders in a stacked configuration with the first and second system boards, sockets, IC packages, and hydraulic bladders to form a stacked cluster. ### Claim 18 (depends on 10) The computer system of claim 10, further comprising a plurality of fasteners, wherein each fastener of the plurality of fasteners extends through the first system board and the second system board to hold them together.