# US 10,455,726 B2 · Modular cooling > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,726 B2 - Document ID: US10455726B2 - Status: Granted - Kind: B2 - Application number: 15/511,983 - Filed: 2014-09-30 - Published: 2017-10-12 - Granted: 2019-10-22 - Earliest claimed: 2014-09-30 - Assignees: Hewlett Packard Enterprise Development LP - Applicants: Hewlett Packard Enterprise Development LP - Inventors: Tahir Cader; John P Franz; David Allen Moore; Douglas Kent Garday; Wade D Vinson - Web page: https://patentgrep.com/patent/US10455726B2 ## CPC - H05K 7/20136: {Forced ventilation, e.g. by fans (H05K7/202 takes precedence)} - G06F 1/20: Cooling means - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - H05K 7/20736: {within cabinets for removing heat from server blades} - H05K 7/20745: {within rooms for removing heat from cabinets, e.g. by air conditioning device} - H05K 7/20781: {within cabinets for removing heat from server blades} - H05K 7/2079: {within rooms for removing heat from cabinets} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A connection assembly is provided herein. The connection assembly includes a liquid connection and an air connection. The liquid connection is positioned in a first location to receive a liquid cooling system. The air connection is positioned in a second location to receive an air cooling system. The liquid connection and the air connection to provide the interface between an electronic system and the liquid cooling system and the electronic system and the air cooling system, wherein the interface is independent of the liquid cooling system and the air cooling system. ## Claims ### Claim 1 A connection assembly usable with a modular cooling system, the connection assembly comprising: a liquid connection to connect to a corresponding liquid connection of an electronic system, the liquid connection positioned in a first location of the connection assembly to receive a liquid cooling system to directly cool the electronic system by liquid passing from the liquid cooling system through the liquid connection of the connection assembly and through the corresponding liquid connection of the electronic system to the electronic system; and an air connection to connect to a corresponding air connection of the electronic system, the air connection positioned in a second location of the connection assembly to receive an air cooling system to directly cool the electronic system, separately from the liquid cooling system cooling the electronic system, by air passing from the air cooling system through the air connection of the connection assembly and through the corresponding air connection of the electronic system to the electronic system, the liquid connection and the air connection to provide an interface of the connection assembly between the electronic system and the liquid cooling system and between the electronic system and the air cooling system by which the liquid cooling system and the air cooling system are connected to the electronic system to permit the liquid cooling system and the air cooling system to directly and separately cool the electronic system, wherein the interface is independent of the liquid cooling system and the air cooling system. ### Claim 2 (depends on 1) The connection assembly of claim 1, wherein the air connection comprises an air supply and an air return. ### Claim 3 (depends on 1) The connection assembly of claim 1, wherein the liquid connection comprises a liquid supply and a liquid return. ### Claim 4 (depends on 1) The connection assembly of claim 1, wherein the liquid connection comprises a blind mate connection. ### Claim 5 (depends on 1) The connection assembly of claim 1, wherein the liquid connection comprises at least one connector selected from the following connectors a cable, a hose, and a valve. ### Claim 6 (depends on 1) The connection assembly of claim 1, further comprising a control connection. ### Claim 7 (depends on 1) The connection assembly of claim 1, further comprising a power connection. ### Claim 8 (depends on 1) The connection assembly of claim 1, further comprising a mounting member to attach the assembly to the electronic system. ### Claim 9 A system to provide modular cooling of an electronic system comprising: a liquid cooling system to directly cool the electronic system; an air cooling system to directly cool the electronic system separately from the liquid cooling system cooling the electronic system; and a connection assembly including: a liquid connection positioned in a first location of the connection assembly to connect to the liquid cooling system and to a corresponding liquid connection of an electronic system, the liquid connection to provide a first interface between the liquid cooling system and the electronic system to directly cool the electronic system by liquid passing from the liquid cooling system through the liquid connection of the connection assembly and through the corresponding liquid connection of the electronic system to the electronic system; and an air connection positioned in a second location of the connection assembly to connect to the air cooling system and to a corresponding air connection of the electronic system, the air connection to provide a second interface between the air cooling system and the electronic system to directly cool the electronic system by air passing from the air cooling system through the air connection of the connection assembly and through the corresponding air connection of the electronic system to the electronic system, wherein the liquid connection and the air connection provide an interface of the connection assembly by which the liquid cooling system and the air cooling system are connected to the electronic system to permit the liquid cooling system and the air cooling system to directly and separately cool the electronic system. ### Claim 10 (depends on 9) The system of claim 9, wherein the first interface interchangeably receives a plurality of liquid cooling systems selected from at least one of the following liquid cooling systems an adiabatic liquid cooler, a “dry cooled” liquid device, an externally supplied coolant, a heat exchanger, an externally supplied cooling unit directly connected to electronic components, and a direct expansion liquid cooling device. ### Claim 11 (depends on 9) The system of claim 9, wherein the second interface to interchangeably receive a plurality of air cooling systems selected from at least one of the following air cooling systems a direct expansion air cooling device, an adiabatic cooled device, an outside air induction device, a facility air cooler device, and a heat exchanger with facility chilled water. ### Claim 12 (depends on 9) The system of claim 9, wherein the connection assembly further comprises a power bus. ### Claim 13 (depends on 9) The system of claim 9, wherein the connection assembly further comprises a control bus. ### Claim 14 A modular cooling system comprising: a liquid cooling system to directly cool an electronic system; an air cooling system to directly cool the electronic system separately from the liquid cooling system; a swappable liquid connection to connect to the electronic system, the swappable liquid connection positioned in a first location of a connection assembly to provide a liquid connection compatible with a plurality of liquid cooling systems, the swappable liquid connection to connect to a corresponding liquid connection of the electronic system, the swappable liquid connection to mate the liquid cooling system with the electronic system to directly cool the electronic system by liquid passing from the liquid cooling system through the liquid connection of the connection assembly and through the corresponding liquid connection of the electronic system to the electronic system; and a swappable air connection to connect to the electronic system, the swappable air connection positioned in a second location of the connection assembly to provide an air connection compatible with a plurality of air cooling systems, the swappable air connection to connect to a corresponding air connection of the electronic system, the swappable air connection to mate the air cooling system with the electronic system to directly cool the electronic system by air passing from the air cooling system through the air connection of the connection assembly and through the corresponding air connection of the electronic system to the electronic system, wherein the liquid connection and the air connection provide an interface of the connection assembly by which the liquid cooling system and the air cooling system are connected to the electronic system to permit the liquid cooling system and the air cooling system to directly and separately cool the electronic system. ### Claim 15 (depends on 14) The modular cooling system of claim 14, wherein the swappable liquid connection and the swappable air connection provide independent connections.