# US 10,455,717 B2 · Implementation method for stacked connection between isolated circuit components and the circuit thereof

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- Number: US 10,455,717 B2
- Document ID: US10455717B2
- Status: Granted
- Kind: B2
- Application number: 15/860,103
- Filed: 2018-01-02
- Published: 2018-05-03
- Granted: 2019-10-22
- Earliest claimed: 2016-04-25
- Assignees: Shenzhen Xilong Toy Company Limited
- Applicants: Shenzhen Xilong Toy Company Limited
- Inventors: Yipu Zheng
- Web page: https://patentgrep.com/patent/US10455717B2

## CPC

- H05K 7/005: {arrangements of circuit components without supporting structure}
- H10D 8/00: Diodes (variable-capacitance diodes H10D1/64; gated diodes H10D12/00)
- H10W 20/484: {Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes}
- H10W 42/00: Arrangements for protection of devices (arrangements for thermal protection H10W40/00)
- H10D 10/00: Bipolar junction transistors [BJT]
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/941: {Dispositions of bond pads}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 80/338: {using EM radiation or electron beams, e.g. using lasers}
- H10W 90/00: Package configurations
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention discloses a modularized circuit for isolated circuit, wherein the isolated circuit includes at least two circuit components connecting in parallel and/or series, the circuit components, according to a circuit connection configuration, weld corresponding pins of the components directly, forming an integrated module in accordance with a desired connection method of the circuit, and saving circuit boards and wires; the circuit components are designed as a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped. Due to constructing a circuit unit by welding connections in a way of building blocks, welding directly between components in a 3D space, comparing to the circuits limited in a circuit board plane as a PCB, it owns a wider design space.

## Claims

### Claim 1

An implementation module for stacked connection between isolated circuit components, whose setting is according to circuit components connecting in parallel/ series in a circuit, wherein, in accordance with a connection configuration of the circuit, a plurality of corresponding pins of the circuit components are welded directly, making the circuit components form an integrated module in accordance with a desired connection method of the circuit, and saving a plurality of circuit boards and connection wires; the circuit component is designed in a parallelepiped, and a plurality of bonding pads are arranged on part of an area on a surface of the parallelepiped;
wherein the parallelepiped has a ratio in length, width and height of 3:2:1 or 3:1:1.

### Claim 2 (depends on 1)

The implementation module for stacked connection between isolated circuit components according to claim 1, wherein the circuit components include a resistor, and bonding pads are arranged on at least two end faces of the resistor.

### Claim 3 (depends on 2)

The implementation module for stacked connection between isolated circuit components according to claim 2, wherein the resistor has a bonding pad arranged on at least one body side face.

### Claim 4 (depends on 1)

The implementation module for stacked connection between isolated circuit components according to claim 1, wherein, the circuit components further include a diode, the diode has two bonding pads arranged for distinguishing different current directions, the bonding pads are arranged on the side face and/or end face of the parallelepiped of the diode.

### Claim 5 (depends on 1)

The implementation module for stacked connection between isolated circuit components according to claim 1, wherein the circuit components further include a triode, on the parallelepiped of the triode, at least three different bonding pads for a base electrode, a collector and an emitter are arranged; the bonding pads for the base electrode and the emitter are arranged on either end face and one of the side face next to the end face accordingly respectively, while the bonding pad for the collector is arranged on a middle position around the parallelepiped.