# US 10,455,707 B1 · Connection pad for embedded components in PCB packaging

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,455,707 B1
- Document ID: US10455707B1
- Status: Granted
- Kind: B1
- Application number: 16/100,456
- Filed: 2018-08-10
- Granted: 2019-10-22
- Earliest claimed: 2018-08-10
- Assignees: Apple Inc.
- Applicants: Apple Inc.
- Inventors: Kenneth Leland Kiplinger; Mark J. Beesley; Shawn Xavier Arnold; Shyam Harindralal Ratnayake; Meng Chi Lee
- Web page: https://patentgrep.com/patent/US10455707B1

## CPC

- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H05K 1/112: {directly combined with via connections}
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/346: Solder materials or compositions specially adapted therefor
- H05K 3/4623: {the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence)}
- H05K 3/4691: {Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/685: comprising multiple insulating layers
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 2201/09481: Via in pad; Pad over filled via
- H05K 2201/10227: Other objects, e.g. metallic pieces
- H05K 2201/10431: Details of mounted components
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/073: {of die-attach connectors}
- H10W 72/874: {On different surfaces}
- H10W 72/9413: {on encapsulations}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/00: Package configurations
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.

## Claims

### Claim 1

A printed circuit board (PCB) assembly, comprising:
a first plurality of metallic routes that form an electrical circuit of the PCB assembly and comprises a first metallic trace disposed in a core of the PCB assembly;
a plurality of electrical pads, wherein a first electrical pad of the plurality of electrical pads comprises a first via termination of a first via and the first via is electrically coupled to the first metallic trace; and
an electrical component electrically disposed in the first electrical pad, wherein a first component termination of the electrical component is directly contacting the first via termination.

### Claim 2 (depends on 1)

The PCB assembly of claim 1, wherein the plurality of electrical pads is arranged in a grid array that comprises a plurality of rows and a plurality of columns, and wherein each electrical pad comprises a width and a length.

### Claim 3 (depends on 2)

The PCB assembly of claim 2, wherein the width is 200 μm or the length is 200 μm.

### Claim 4 (depends on 1)

The PCB assembly of claim 1, wherein the first electrical pad comprises a second via termination of a second via.

### Claim 5 (depends on 4)

The PCB assembly of claim 4, wherein the electrical component comprises a second component termination directly in contact with the second via termination of the second via.

### Claim 6 (depends on 4)

The PCB assembly of claim 4, comprising a second electrical component disposed in the first electrical pad, wherein a second component termination of the second electrical component is directly contacting the second via termination of the second via.

### Claim 7 (depends on 1)

The PCB assembly of claim 1, wherein the first electrical pad comprises a plurality of vias electrically coupled to each other and configured to form a single connection to the first component termination of the electrical component, wherein a number of vias in the plurality of vias is based on a resistance specification or an inductance specification, and wherein the resistance specification or the inductance specification is based on the electrical component.

### Claim 8 (depends on 1)

The PCB assembly of claim 1, comprising a first cavity that comprises the first electrical pad, and wherein the electrical component is disposed in the first cavity.

### Claim 9 (depends on 8)

The PCB assembly of claim 8, comprising a resin configured to hold the electrical component in the first cavity.

### Claim 10

An electronic device, comprising:
a printed circuit board (PCB), comprising:
a first electrical circuit that comprises a plurality of metallic traces disposed in a core of the PCB and a plurality of metallic vias, wherein each via of the plurality of metallic vias is coupled to a first metallic trace of the plurality of metallic traces;
a plurality of electrical pads, wherein each electrical pad of the plurality of electrical pads comprise a plurality of via terminations, and each respective via termination of the plurality of via terminations is associated to a respective via of the plurality of metallic vias; and
an electrical component electrically coupled to the first electrical circuit and disposed in a first electrical pad of the plurality of electrical pads, wherein each respective component termination of the electrical component is in direct contact with a corresponding via termination of the plurality of via terminations.

### Claim 11 (depends on 10)

The electronic device of claim 10, wherein the first electrical pad is a non-uniform electrical pad.

### Claim 12 (depends on 10)

The electronic device of claim 10, comprising a second electrical pad of the plurality of electrical pads, wherein the second electrical pad comprises a shielding pad electrically coupled to a ground of the PCB.

### Claim 13 (depends on 12)

The electronic device of claim 12, wherein the first electrical pad and the second electrical pad are nested, and wherein the shielding pad is configured to provide electrical shielding to at least one via termination of the plurality of via terminations.

### Claim 14 (depends on 10)

The electronic device of claim 10, comprising a second electrical component, wherein the second electrical component is soldered to the PCB.

### Claim 15 (depends on 10)

The electronic device of claim 10, wherein the first electrical pad comprises a cavity and the electrical component is disposed in the cavity.

### Claim 16 (depends on 15)

The electronic device of claim 15, comprising a resin that covers the electrical component.

### Claim 17 (depends on 10)

The electronic device of claim 10, wherein the PCB comprises a multilayer PCB.

### Claim 18

A method comprising:
forming a first metallic trace in a core of a printed circuit board (PCB);
forming a first via in the PCB, wherein the first via is electrically coupled to the first metallic trace, and wherein a via termination of the first via is exposed in an electrical pad of the PCB; and
disposing a first electrical component in the electrical pad of the PCB by forming a direct contact between a component termination of the first electrical component and the via termination of the first via.

### Claim 19 (depends on 18)

The method of claim 18, comprising forming a cavity in the core of the PCB, wherein the cavity is configured to receive the first electrical component.

### Claim 20 (depends on 19)

The method of claim 19, comprising encapsulating the first electrical component using a resin.

### Claim 21

A printed circuit board (PCB) assembly, comprising:
a first plurality of metallic routes that form an electrical circuit of the PCB assembly;
a plurality of electrical pads, wherein a first electrical pad of the plurality of electrical pads comprises:
a first via termination of a first via, wherein the first via is electrically coupled to the first plurality of metallic routes plurality of vias electrically coupled to each other and to the first plurality of metallic routes and wherein the plurality of vias form a single connection;
a plurality of vias electrically coupled to each other and configured to form a single connection to the first component termination of the electrical component, wherein a number of vias in the plurality of vias is based on a resistance specification or an inductance specification, and wherein the resistance specification or the inductance specification is based on the electrical component; and
an electrical component electrically disposed in the first electrical pad, wherein a first component termination of the electrical component is directly contacting the first via termination and comprising a first component termination in direct contact with the single connection.

### Claim 22 (depends on 21)

The PCB assembly of claim 21, wherein the electrical component comprises a second component termination in direct contact with a second connection disposed in the first electrical pad.

### Claim 23 (depends on 21)

The PCB assembly of claim 21, comprising a first cavity that comprises the first electrical pad, and wherein the electrical component is disposed in the first cavity.