# US 10,455,706 B2 · Resin substrate, component mounted resin substrate, and method of manufacturing component mounted resin substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,706 B2 - Document ID: US10455706B2 - Status: Granted - Kind: B2 - Application number: 15/928,175 - Filed: 2018-03-22 - Published: 2018-07-26 - Granted: 2019-10-22 - Earliest claimed: 2015-10-15 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Shigeru Tago; Kuniaki Yosui; Yuki Ito - Web page: https://patentgrep.com/patent/US10455706B2 ## CPC - H05K 3/32: electrically connecting electric components or wires to printed circuits - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via} - H05K 3/0011: {Working of insulating substrates or insulating layers} - H05K 3/46: Manufacturing multilayer circuits - H05K 3/4632: {laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 1/181: associated with surface mounted components - H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components} - H05K 3/4069: {for via connections in organic insulating substrates} - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/0141: Liquid crystal polymer [LCP] - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H05K 2203/0285: Using ultrasound, e.g. for cleaning, soldering or wet treatment - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view. ## Claims ### Claim 1 A resin substrate comprising: a thermoplastic resin base body; a mounting land conductor provided on a surface of the resin base body to be connected to a component; a first reinforcement conductor pattern embedded in the resin base body, and having a planar shape overlapping an entirety or substantially an entirety of the mounting land conductor when viewing the resin base body in plan view; a second reinforcement conductor pattern embedded in the resin base body, and having a planar shape of which at least a portion overlaps the first reinforcement conductor pattern, and which includes a position overlapping the mounting land conductor, when viewing the resin base body in plan view; a plurality of first interlayer connection conductors connecting the first reinforcement conductor pattern and the second reinforcement conductor pattern in a thickness direction of the resin base body; a third reinforcement conductor pattern embedded in the resin base body, and having a planar shape of which at least a portion overlaps the first reinforcement conductor pattern and the second reinforcement conductor pattern, and which includes a position overlapping the mounting land conductor, when viewing the resin base body in plan view; and a plurality of second interlayer connection conductors connecting the second reinforcement conductor pattern and the third reinforcement conductor pattern in the thickness direction of the resin base body; wherein the plurality of first interlayer connection conductors are located at positions different from the mounting land conductor when viewing the resin base body in plan view; and the plurality of first interlayer connection conductors and the plurality of second interlayer connection conductors are located at different positions when viewing the resin base body in plan view. ### Claim 2 (depends on 1) The resin substrate according to claim 1, wherein the first reinforcement conductor pattern, the second reinforcement conductor pattern, the plurality of first interlayer connection conductors, the third reinforcement conductor pattern, and the plurality of second interlayer connection conductors are not connected to other conductor patterns in contact with the resin base body. ### Claim 3 (depends on 1) The resin substrate according to claim 1, wherein the mounting land conductor includes a plurality of mounting land conductors; and the first reinforcement conductor pattern overlaps the plurality of mounting land conductors when viewing the resin base body in plan view. ### Claim 4 (depends on 3) The resin substrate according to claim 3, wherein the first reinforcement conductor pattern includes, at a position different from positions of the plurality of mounting land conductors, a conductor non-formed portion in which the first reinforcement conductor pattern is not provided, when viewing the resin base body in plan view. ### Claim 5 (depends on 1) The resin substrate according to claim 1, wherein a distance between the first reinforcement conductor pattern and the surface of the resin base body is smaller than half a thickness of the resin base body. ### Claim 6 (depends on 5) The resin substrate according to claim 5, wherein the resin base body includes a plurality of thermoplastic resin layers that are stacked; and the first reinforcement conductor pattern is located between a first resin layer of the plurality of thermoplastic resin layers at the surface of the resin base body at which the mounting land conductor is provided and a second resin layer of the plurality of thermoplastic resin layers contacting the first resin layer. ### Claim 7 (depends on 1) A component mounted resin substrate comprising: the resin substrate according to of claim 1; and the component connected to the mounting land conductor. ### Claim 8 A component mounted resin substrate comprising: a resin substrate including: a thermoplastic resin base body; a mounting land conductor provided on a surface of the resin base body and connected to the component; a first reinforcement conductor pattern embedded in the resin base body, and having a planar shape including a position overlapping the mounting land conductor when viewing the resin base body in plan view; a second reinforcement conductor pattern embedded in the resin base body, and having a planar shape of which at least a portion overlaps the first reinforcement conductor pattern, and which includes a position overlapping the mounting land conductor, when viewing the resin base body in plan view; and a plurality of first interlayer connection conductors connecting the first reinforcement conductor pattern and the second reinforcement conductor pattern in a thickness direction of the resin base body; a component joined to the resin substrate with a plurality of bumps interposed therebetween; a third reinforcement conductor pattern embedded in the resin base body, and having a planar shape of which at least a portion overlaps the first reinforcement conductor pattern and the second reinforcement conductor pattern, and which includes a position overlapping the mounting land conductor, when viewing the resin base body in plan view; and a plurality of second interlayer connection conductors connecting the second reinforcement conductor pattern and the third reinforcement conductor pattern in the thickness direction of the resin base body; wherein the component is mounted to the resin base body with the plurality of bumps ultrasonically joined to the mounting land conductor; the plurality of first interlayer connection conductors are located at positions different from the plurality of bumps when viewing the resin base body in plan view; the plurality of bumps entirely or substantially entirely overlap the first reinforcement conductor pattern when viewing the resin base body in plan view; and the plurality of first interlayer connection conductors and the plurality of second interlayer connection conductors are located at different positions when viewing the resin base body in plan view. ### Claim 9 (depends on 8) The component mounted resin substrate according to claim 8, wherein the first reinforcement conductor pattern, the second reinforcement conductor pattern, the plurality of first interlayer connection conductors, the third reinforcement conductor pattern, and the plurality of second interlayer connection conductors are not connected to other conductor patterns in contact with the resin base body. ### Claim 10 (depends on 8) The component mounted resin substrate according to claim 8, wherein the mounting land conductor includes a plurality of mounting land conductors; and the first reinforcement conductor pattern overlaps the plurality of mounting land conductors when viewing the resin base body in plan view. ### Claim 11 (depends on 10) The component mounted resin substrate according to claim 10, wherein the first reinforcement conductor pattern includes, at a position different from positions of the plurality of mounting land conductors, a conductor non-formed portion in which the first reinforcement conductor pattern is not provided, when viewing the resin base body in plan view. ### Claim 12 (depends on 8) The component mounted resin substrate according to claim 8, wherein a distance between the first reinforcement conductor pattern and the surface of the resin base body is smaller than half a thickness of the resin base body. ### Claim 13 (depends on 12) The component mounted resin substrate according to claim 12, wherein the resin base body includes a plurality of thermoplastic resin layers that are stacked; and the first reinforcement conductor pattern is located between a first resin layer of the plurality of thermoplastic resin layers at the surface of the resin base body at which the mounting land conductor is provided and a second resin layer of the plurality of thermoplastic resin layers contacting the first resin layer. ### Claim 14 (depends on 8) The component mounted resin substrate according to claim 8, wherein, assuming that, when viewing the resin base body in plan view, a circular region is set for each of the plurality of first interlayer connection conductors, the circular region having a center in a position of one of the plurality of first interlayer connection conductors and a radius defined by a distance between the one of the plurality of first interlayer connection conductors and another of the plurality of first interlayer connection conductors closest the one of the plurality of first interlayer connection conductors, at least one of the plurality of bumps overlaps a region in which circular regions overlap each other.