# US 10,455,703 B2 · Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,703 B2 - Document ID: US10455703B2 - Status: Granted - Kind: B2 - Application number: 15/121,844 - Filed: 2015-02-20 - Published: 2017-01-19 - Granted: 2019-10-22 - Earliest claimed: 2014-02-28 - Assignees: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Applicants: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft - Inventors: Gerald Weidinger - Web page: https://patentgrep.com/patent/US10455703B2 ## CPC - H05K 1/188: {manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component} - H10W 72/0198: {batch processes} - H05K 1/095: {for polymer thick films, i.e. having a permanent organic polymeric binder} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)} - H05K 3/1216: {by screen printing or stencil printing} - H05K 3/207: {using a prefabricated paste pattern, ink pattern or powder pattern} - H05K 3/321: by conductive adhesives - H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 74/114: {by a substrate and the encapsulations} - H05K 2201/10151: Sensor - H10P 72/7436: {used to support a device or a wafer when forming electrical connections thereto} - H10W 72/859: {Bump connectors and bond wires} - H10W 72/9413: {on encapsulations} - H10W 90/753: {between laterally-adjacent chips} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method for producing a printed circuit board (10) having at least one embedded sensor chip (3), in which at least one sensor face (5) and terminals (4) are arranged on a face of the chip, said method comprising the following steps: a) providing an adhesive film (1), b) printing a conductor structure (2) formed from a conductive paste onto a surface of the adhesive film, c) placing the at least one sensor chip (3) with the face comprising the at least one sensor face (5) and the terminals (4) onto the conductor structure (2) formed from a conductive paste, in an indexed manner, d) curing the conductive paste, e) applying an insulation layer (6) having a conductor layer (7) arranged thereabove to the surface of the structure, created in the previous steps, comprising the chip (3), f) laminating the structure created in the previous steps, g) structuring the conductor layer (7) and forming vias (9) from the conductor layer to conductive tracks (7b, 7c) of the conductor structure on the surface of the adhesive film, and h) removing the adhesive film (1). ## Claims ### Claim 1 A printed circuit board consisting of at least one insulation layer and at least one structured conductor layer having at least one embedded sensor chip, in which at least one sensor face and terminals are arranged on a face of the sensor chip and lie in a substantially coplanar manner on a face of the printed circuit board, facing away from the structured conductor layer, wherein a surface of the at least one sensor face, a surface of the at least one sensor, and a surface of the at least one insulation layer are coplanar, and wherein the terminals of the sensor chip are connected to a conductor structure consisting of a conductive paste, and vias extend from this conductor structure to conductive tracks of the structured conductor layer. ### Claim 2 (depends on 1) The printed circuit board of claim 1, wherein the face of the sensor chip on which the at least one sensor face and the terminals are arranged is substantially coplanar with the surface of the insulation layer and terminates flush therewith. ### Claim 3 (depends on 2) The printed circuit board of claim 2, wherein the conductor structure is attached to the substantially coplanar surface of the sensor chip and the insulation layer, facing away from the structured conductor layer. ### Claim 4 (depends on 1) The printed circuit board of claim 1, wherein at least a part of the conductor structure is attached to the surface of the insulation layer, facing away from the structured conductor layer. ### Claim 5 (depends on 1) The printed circuit board of claim 1, wherein at least a part of the conductor structure is attached to the surface of the sensor chip on which the terminals of the sensor chip are arranged. ### Claim 6 (depends on 1) The printed circuit board of claim 1, wherein the terminals of the sensor chip are aligned with the corresponding contact points of the conductor structure and said terminals penetrate the conductor structure. ### Claim 7 (depends on 1) The printed circuit board of claim 1, wherein the layer thickness of the conductor structure is in the range of 5 μm to 30 μm. ### Claim 8 (depends on 1) The printed circuit board of claim 1, wherein the conductor structure is made of a hardened conductive paste. ### Claim 9 (depends on 1) The printed circuit board of claim 1, wherein the sensor chip is arranged at a position that is outermost of built-up layers of the printed circuit board.