# US 10,455,702 B2 · Method for manufacturing a multilayer structure for hosting electronics

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- Number: US 10,455,702 B2
- Document ID: US10455702B2
- Status: Granted
- Kind: B2
- Application number: 16/038,864
- Filed: 2018-07-18
- Published: 2019-02-28
- Granted: 2019-10-22
- Earliest claimed: 2017-08-25
- Assignees: Tactotek Oy
- Applicants: TactoTek Oy
- Inventors: Antti Keranen; Ronald Haag; Mikko Heikkinen
- Web page: https://patentgrep.com/patent/US10455702B2

## CPC

- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 3/4069: {for via connections in organic insulating substrates}
- H05K 1/0266: {Marks, test patterns or identification means}
- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- H05K 2201/0108: Transparent
- H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H05K 2201/09563: Metal filled via
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2201/10151: Sensor
- H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
- H05K 2203/1316: Moulded encapsulation of mounted components
- H05K 2203/1327: Moulding over PCB locally or completely
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method for manufacturing a multilayer structure includes obtaining a first substrate film for accommodating electronics, providing circuitry on at least the second side of the first substrate film, forming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing at least a portion of the circuitry on the at least the second side of the first substrate film, and melding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.

## Claims

### Claim 1

A method for manufacturing a multilayer structure, comprising:
obtaining a first substrate film for accommodating electronics, the first substrate film having a planar shape including a first side and an opposite second side, the first substrate film comprising an electrically insulating material;
providing at least on electronic component and at least one conductor on at least the second side of the first substrate film, the at least one electronic component being functionally connected to the first side of the first substrate film;
thermoforming the first substrate film to at least locally or more widely exhibit a selected non-planar three-dimensional shape subsequent to providing the at least one electronic component on the at least the second side of the first substrate film; and
molding plastic material on the first side of the first substrate film so as to at least partially cover the first side of the first substrate film.

### Claim 2 (depends on 1)

The method of claim 1, further comprising molding a second plastic layer on the second side of the first substrate film.

### Claim 3 (depends on 2)

The method of claim 2, wherein molding the second plastic layer comprises molding by low-pressure injection molding.

### Claim 4 (depends on 1)

The method of claim 1, further comprising embedding at least one color or graphics layer defining a selected color, figure, icon, graphical pattern, symbol, text, numeric, alphanumeric, or other visual indication feature in the structure.

### Claim 5 (depends on 4)

The method of claim 4, wherein embedding comprises at least one of lamination or printing.

### Claim 6 (depends on 1)

The method of claim 1, further comprising providing a second film on a side of the plastic layer facing away from the first substrate film.

### Claim 7 (depends on 6)

The method of claim 6, wherein providing the second film further comprises accommodating at least one of graphic or electronics thereon.

### Claim 8 (depends on 1)

The method of claim 1, further comprising providing an electrically conductive via in the first substrate film to electrically couple circuitry on both sides thereof.

### Claim 9 (depends on 1)

The method of claim 1, wherein the first substrate film is at least one of formable or a thermoplastic.

### Claim 10 (depends on 1)

The method of claim 1, wherein providing the circuitry comprises at least one of mounting or printed electronics technology.

### Claim 11 (depends on 1)

The method of claim 1, wherein molding the plastic material comprises at least one of injection molding or reactive molding.