# US 10,455,701 B2 · Resin board structure and method for fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,701 B2 - Document ID: US10455701B2 - Status: Granted - Kind: B2 - Application number: 15/907,366 - Filed: 2018-02-28 - Published: 2018-07-05 - Granted: 2019-10-22 - Earliest claimed: 2015-10-02 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yoshihito Otsubo; Masaaki Minami - Web page: https://patentgrep.com/patent/US10455701B2 ## CPC - H05K 1/142: {Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit} - B23K 20/10: making use of vibrations, e.g. ultrasonic welding - B29C 65/08: using ultrasonic vibrations {(non-plastics element to plastics elements B29C65/645)} - B29C 65/081: {having a component of vibration not perpendicular to the welding surface} - B29C 66/1282: {comprising at least one overlap joint-segment} - B29C 66/12841: {comprising at least two butt joint-segments} - B29C 66/43: {Joining a relatively small portion of the surface of said articles (B29C66/45 takes precedence)} - B29C 66/72321: {consisting of metals or their alloys} - B29C 66/73161: {Roughness or rugosity} - B29C 66/73921: {characterised by the materials of both parts being thermoplastics} - B29C 66/742: {to metals or their alloys} - B29C 66/81419: {and flat} - B29C 66/8322: {Joining or pressing tools reciprocating along one axis} - B32B 3/06: for securing layers together; for attaching the product to another member, e.g. to a support {, or to another product, e.g. groove/tongue, interlocking} - B32B 3/08: characterised by added members at particular parts {(layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18)} - B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} - B32B 5/145: {Variation across the thickness of the layer} - B32B 7/08: by mechanical means - B32B 15/08: of synthetic resin - B32B 27/06: as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08)} - B32B 27/08: of synthetic resin - H05K 3/328: by welding - H05K 3/36: Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - B29C 66/71: {characterised by the composition of the plastics material of the parts to be joined (welding bar compositions B29C65/125)} - B29K 2705/02: Aluminium - B29K 2995/0072: Roughness, e.g. anti-slip - B29K 2995/0074: patterned, grained - B29L 2031/3425: {Printed circuits} - B32B 2250/44: Number of layers variable across the laminate - B32B 2307/746: Slipping, anti-blocking, low friction - B32B 2457/08: PCBs, i.e. printed circuit boards - H05K 1/0313: {Organic insulating material} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer - H05K 2201/09036: Recesses or grooves in insulating substrate - H05K 2203/0278: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive - H05K 2203/0285: Using ultrasound, e.g. for cleaning, soldering or wet treatment - Y10T 428/19: Sheets or webs edge spliced or joined - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A resin board structure includes a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, and a second member including a second metal film. The first and second metal films are bonded together, and at least a portion the first metal film and at least a portion of the second metal film overlap each other. The first and second metal films are metallurgically bonded at an interface between the first metal film and the second metal film. The first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other, and the first junction resin covering portion includes an uneven surface to reduce or prevent slippage due to ultrasonic vibration. ## Claims ### Claim 1 A resin board structure comprising: a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and a second member including a second metal film; wherein the first metal film and the second metal film are bonded together, at least a portion of the first metal film and at least a portion of the second metal film overlap each other, the first metal film and the second metal film being metallurgically bonded at an interface between the first metal film and the second metal film; the first member includes a first junction resin covering portion including a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other; the first junction resin covering portion includes an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration; the second member includes a second junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other; and the second junction resin covering portion includes an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration. ### Claim 2 (depends on 1) The resin board structure according to claim 1, wherein the first junction resin covering portion is thinner than any other portions of the first member. ### Claim 3 (depends on 1) The resin board structure according to claim 1, wherein the second member includes one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and the first member and the second member are welded together at a contact portion between thermoplastic resin layers. ### Claim 4 (depends on 1) The resin board structure according to claim 1, wherein the second member is a motherboard. ### Claim 5 (depends on 1) The resin board structure according to claim 1, further comprising a first protective film provided over a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration. ### Claim 6 (depends on 1) The resin board structure according to claim 1, further comprising: a first protective film provided over a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration; and a second protective film provided over a surface of the second junction resin covering portion, the second protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration. ### Claim 7 A resin board structure comprising: a first member including a first metal film and including one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and a second member including a second metal film; wherein the first metal film and the second metal film are bonded together, at least a portion of the first metal film and at least a portion of the second metal film overlap each other, the first metal film and the second metal film being metallurgically bonded at an interface between the first metal film and the second metal film; the first member includes a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other; a first protective film is provided over a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration; the second member includes a second junction resin covering portion including a portion of a thermoplastic resin layer and overlapping a portion at which the first metal film and the second metal film overlap each other; and the second junction resin covering portion includes an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration. ### Claim 8 (depends on 7) The resin board structure according to claim 7, wherein the second member is a motherboard. ### Claim 9 (depends on 7) The resin board structure according to claim 7, wherein a second protective film is provided over a surface of the second junction resin covering portion, the second protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration. ### Claim 10 (depends on 2) The resin board structure according to claim 2, wherein the first junction resin covering portion is thinner than any other portions of the first member. ### Claim 11 A method for fabricating a resin board structure, the method comprising: preparing a first member including a first metal film and one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, the first member including a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping the first metal film, the first junction resin covering portion including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration; preparing a second member including a second metal film; disposing the first member and the second member such that at least a portion of the first metal film and at least a portion of the second metal film are in contact with each other and overlap each other; and bonding the first metal film and the second metal film together by application of relative ultrasonic vibration between the first metal film and the second metal film. ### Claim 12 (depends on 11) The method according to claim 11, wherein the first junction resin covering portion is thinner than any other portions of the first member. ### Claim 13 (depends on 11) The method according to claim 11, wherein the second member includes one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers; and bonding the first metal film and the second metal film together bonds the first member and the second member together by welding at a contact portion between thermoplastic resin layers. ### Claim 14 (depends on 11) The method according to claim 11, wherein the second member is a motherboard. ### Claim 15 A method for fabricating a resin board structure, the method comprising: preparing a first member including a first metal film and including one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, the first member including a first junction resin covering portion defined by a portion of a thermoplastic resin layer and overlapping the first metal film; preparing a second member having a second metal film; disposing the first member and the second member such that at least a portion of the first metal film and at least a portion of the second metal film are in contact with each other and overlap each other; and bonding the first metal film and the second metal film together by application of relative ultrasonic vibration between the first metal film and the second metal film; wherein the first member includes a first protective film covering a surface of the first junction resin covering portion, the first protective film including an uneven surface including unevenness to reduce or prevent slippage due to ultrasonic vibration. ### Claim 16 (depends on 15) The method according to claim 15, wherein the first junction resin covering portion is thinner than any other portions of the first member. ### Claim 17 (depends on 15) The method according to claim 15, wherein the second member is prepared to further include one thermoplastic resin layer or a stack which includes two or more thermoplastic resin layers, a second junction resin covering portion including a portion of a thermoplastic resin layer and overlapping the second metal film, and a second protective film covering a surface of the second junction resin covering portion, the second protective film including an uneven surface to reduce or prevent slippage due to ultrasonic vibration.