# US 10,455,696 B2 · Electrically conducting assemblies

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- Number: US 10,455,696 B2
- Document ID: US10455696B2
- Status: Granted
- Kind: B2
- Application number: 14/917,172
- Filed: 2014-09-05
- Published: 2016-07-21
- Granted: 2019-10-22
- Earliest claimed: 2013-09-06
- Assignees: Solvay Specialty Polymers Italy S.P.A.
- Applicants: Solvay Specialty Polymers Italy S.P.A.
- Inventors: Paula Cojocaru; Marco Apostolo; Alessio Marrani; Ivan Falco
- Web page: https://patentgrep.com/patent/US10455696B2

## CPC

- C08J 7/044: Forming conductive coatings; Forming coatings having anti-static properties
- C03C 17/38: at least one coating being a coating of an organic material
- C08J 7/06: with compositions not containing macromolecular substances
- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- H05K 1/0298: {Multilayer circuits}
- H05K 3/0041: {by plasma etching}
- H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
- H05K 3/1225: {Screens or stencils; Holders therefor}
- H05K 3/125: {by ink-jet printing}
- H05K 3/182: {characterised by the patterning method}
- H05K 3/227: {Drying of printed circuits}
- H05K 3/4661: {Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)}
- H05K 3/4664: {Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)}
- C08J 2367/02: Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence)
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process and to uses of said multilayer assembly in various applications.

## Claims

### Claim 1

A process for the manufacture of a multilayer assembly, said process comprising:
applying a patterned layer (LMP) of at least one patterned substrate directly onto a non-patterned layer (LMT) of at least one non-patterned substrate, thereby providing a multilayer assembly, wherein:
(1) the at least one patterned substrate is obtained by a process comprising:
printing a liquid composition (L1) comprising at least one first metal compound (M1) onto at least one surface of an optically transparent substrate layer (LT-1) having an outer surface and an inner surface to form a patterned layer (LMP), thus providing a patterned substrate,
optionally, contacting the patterned layer (LMP) with a liquid composition (L2) comprising at least one second metal compound (M2), said compound (M2) being equal to or different from the compound (M1), and
drying the patterned substrate, optionally contacted with composition (L2), at a temperature of at least 50° C.; and wherein
(2) the at least one non-patterned substrate is obtained by a process comprising:
optionally, treating by a radio-frequency glow discharge process in the presence of an etching gas, at least one surface of an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, said layer (LT-2) being equal to or different from layer (LT-1),
contacting optionally treated layer (LT-2) with a liquid composition (L3) comprising at least one optically transparent metal compound (Mot), to form an optically transparent non-patterned layer (LMT), thus providing a non-patterned substrate, and
drying the non-patterned substrate at a temperature of at least 50° C.

### Claim 2 (depends on 1)

The process according to claim 1, wherein compound (Mot) is a metal oxide selected from the group consisting of:
impurity-doped ZnO, In2O3, SnO2 and CdO,
ternary metal oxide compounds, and
multi-component metal oxides consisting of combinations of ZnO, In2O3 and SnO2.

### Claim 3 (depends on 2)

The process according to claim 2, wherein compound (Mot) is a metal oxide selected from the group consisting of Sn-doped ZnO, Sn-doped In2O3, Sn-doped CdO, Zn2SnO4, ZnSnO3, Zn2In2O5, Zn3In2O6, In2SnO4, and CdSnO3.

### Claim 4 (depends on 1)

The process according to claim 1, wherein layer (LT-2) is contacted with composition (L3) by electroless plating techniques.

### Claim 5 (depends on 1)

The process according to claim 1, wherein compound (M1) is selected from the group consisting of Rh, Ir, Ru, Ti, Re, Os, Cd, Tl, Pb, Bi, In, Sb, Al, Ti, Cu, Ni, Pd, V, Fe, Cr, Mn, Co, Zn, Mo, W, Ag, Au, Pt, Ir, Ru, Pd, Sn, Ge, Ga, alloys thereof and derivatives thereof.

### Claim 6 (depends on 1)

The process according to claim 1, wherein composition (L1) is printed by screen, gravure, flexo or ink-jet printing techniques.

### Claim 7 (depends on 1)

The process according to claim 1, wherein compound (M2) is selected from the group consisting of Rh, Ir, Ru, Ti, Re, Os, Cd, Tl, Pb, Bi, In, Sb, Al, Ti, Cu, Ni, Pd, V, Fe, Cr, Mn, Co, Zn, Mo, W, Ag, Au, Pt, Ir, Ru, Pd, Sn, Ge, Ga, alloys thereof and derivatives thereof.

### Claim 8 (depends on 1)

The process according to claim 1, wherein layer (LMP) is contacted with composition (L2) by electroplating or electroless plating techniques.

### Claim 9

A process for the manufacture of a multilayer assembly, said process comprising:
printing a liquid composition (L1) comprising at least one first metal compound (M1) onto an optically transparent substrate layer (LT-1) having an outer surface and an inner surface,
wherein layer (LT-1) is a non-patterned substrate comprising:
an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, and
an optically transparent non-patterned layer (LMT) made of at least one optically transparent metal compound (Mot) directly adhered onto at least one surface of layer (LT-2), and
wherein said at least one surface of layer (LT-2) is optionally treated by a radio-frequency glow discharge process in the presence of an etching gas,
wherein the liquid composition (L1) is printed directly on the surface of layer (LMT) that is opposite to layer (LT-2), to form a patterned layer (LMP),
optionally, contacting patterned layer (LMP) with a liquid composition (L2) comprising at least one second metal compound (M2), said compound (M2) being equal to or different from the compound (M1), and
drying the patterned substrate, optionally contacted with composition (L2), at a temperature of at least 50° C.

### Claim 10 (depends on 9)

The process according to claim 9, wherein the non-patterned substrate is obtained by a process comprising:
optionally, treating by a radio-frequency glow discharge process in the presence of an etching gas, at least one surface of an optically transparent substrate layer (LT-2) having an outer surface and an inner surface,
contacting optionally treated layer (LT-2) with a liquid composition (L3) comprising at least one optically transparent metal compound (Mot), to form an optically transparent non-patterned layer (LMT), thus providing a non-patterned substrate, and
drying the non-patterned substrate at a temperature of at least 50° C.