# US 10,455,693 B2 · Display device comprising remaining portion of inspection line with cut edge

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- Number: US 10,455,693 B2
- Document ID: US10455693B2
- Status: Granted
- Kind: B2
- Application number: 14/724,370
- Filed: 2015-05-28
- Published: 2016-06-09
- Granted: 2019-10-22
- Earliest claimed: 2014-12-08
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Myong soo Oh
- Web page: https://patentgrep.com/patent/US10455693B2

## CPC

- H05K 1/0268: {for electrical inspection or testing}
- G02F 1/1309: {Repairing; Testing}
- G02F 1/13458: {Terminal pads}
- H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)}
- H10D 86/411: {characterised by materials, geometry or structure of the substrates}
- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10D 86/443: {adapted for preventing breakage, peeling or short circuiting}
- H10D 86/60: wherein the TFTs are in active matrices
- H10P 74/273: {Interconnections for measuring or testing, e.g. probe pads}
- H10W 70/688: {Flexible insulating substrates}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H05K 2201/0326: Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
- H05K 2201/10128: Display
- H10W 72/077: {Connecting of TAB connectors}
- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A display device includes: a substrate including a display area in which a plurality of pixels are disposed and a non-display area adjacent to the display area; a plurality of pads disposed in the non-display area; an inspection line disposed in the non-display area of the substrate and being spaced apart from the pad; a conductive member connecting the pad and the inspection line; and a tape-automated bonding integrated circuit (TAB-IC) disposed on the conductive member.

## Claims

### Claim 1

A display device comprising:
a substrate including a display area in which a plurality of pixels are disposed and a non-display area adjacent to the display area;
a pad disposed in the non-display area;
an inspection line disposed on the substrate to overlap a cutting line so as to form, upon being cut, a remaining portion of the inspection line with a cut edge disposed in the non-display area of the substrate and being spaced apart from the pad;
a conductive member connecting the pad to the remaining portion of the inspection line; and
a tape-automated bonding integrated circuit (TAB-IC) disposed on the conductive member, the conductive member disposed between the pad and the tape-automated bonding integrated circuit, the TAB-IC includes a flexible printed circuit board (FPCB), a drive integrated circuit (IC) mounted on the FPCB, and a lead wiring extending from the drive IC;
wherein the FPCB and the lead wiring overlap both the pad and the remaining portion of the inspection line.

### Claim 2 (depends on 1)

The display device of claim 1, further comprising a gate line and a data line disposed on the substrate, wherein the pad is connected to the gate line and the data line.

### Claim 3 (depends on 1)

The display device of claim 1, wherein the remaining portion of the inspection line is disposed in an outer portion of the non-display area than the pad.

### Claim 4 (depends on 3)

The display device of claim 3, wherein the remaining portion of the inspection line is spaced apart from the pad by a distance in a range of about 5 micrometers (μm) to 50 μm.

### Claim 5 (depends on 1)

The display device of claim 1, wherein the pad and the remaining portion of the inspection line include at least one selected from the group consisting of chrominum (Cr), aluminum (Al), molibden (Mo), titanium (Ti), tungsten (W), and gold (Au).

### Claim 6 (depends on 1)

The display device of claim 1, wherein the conductive member includes at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), and zinc oxide (ZnO).

### Claim 7 (depends on 1)

The display device of claim 1, wherein the drive IC includes one selected from the group consisting of a gate IC and a data IC.

### Claim 8 (depends on 1)

The display device of claim 1, wherein the lead wiring is electrically connected to the conductive member.

### Claim 9 (depends on 1)

The display device of claim 1, further comprising an anisotropic conductive film (ACF) disposed between the lead wiring and the conductive member.

### Claim 10 (depends on 1)

The display device of claim 1, wherein an area where the TAB-IC overlaps the pad is larger than an area where the TAB-IC overlaps the remaining portion of the inspection line.

### Claim 11

A display device, comprising:
a first substrate;
a second substrate disposed on the first substrate having a plurality of pixels, said first substrate having a larger surface area than the second substrate, the first and second substrates have a rectangular shape;
a pad disposed on the first substrate;
an inspection line disposed on the first substrate to overlap a cutting line so as to form, upon being cut, a remaining portion of the inspection line with a cut edge;
a conductive member connecting the pad to the remaining portion of the inspection line; and
a tape-automated bonding integrated circuit (TAB-IC) disposed on the conductive member, the conductive member disposed between the pad and the tape-automated bonding integrated circuit, the TAB-IC includes a flexible printed circuit board (FPCB), a drive integrated circuit (IC) mounted on the FPCB, and a lead wiring extending from the drive IC;
wherein the pad, the remaining portion of the inspection line and the TAB-IC have no direct contact with the second substrate,
wherein the FPCB and the lead wiring overlap both the pad and the remaining portion of the inspection line.

### Claim 12 (depends on 11)

The display device of claim 11, further comprising a gate line and a data line disposed on the first substrate, wherein the pad is connected to the gate line and the data line.

### Claim 13 (depends on 11)

The display device of claim 11, wherein the remaining portion of the inspection line has a rectangular prism shape with four sides and two ends with one of the two ends directly physically connected to an inspection pad and another of the two ends having a distance from the pad in a range of about 5 micrometers (μm) to 50 μm.

### Claim 14 (depends on 11)

The display device of claim 11, wherein the pad and the remaining portion of the inspection line include at least one selected from the group consisting of chrominum (Cr), aluminum (Al), molibden (Mo), titanium (Ti), tungsten (W), and gold (Au).

### Claim 15 (depends on 11)

The display device of claim 11, wherein the conductive member includes at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), and zinc oxide (ZnO).

### Claim 16 (depends on 11)

The display device of claim 11, wherein the drive IC includes one selected from the group consisting of a gate IC and a data IC.

### Claim 17 (depends on 11)

The display device of claim 11, further comprising an anisotropic conductive film (ACF) disposed between the lead wiring and the conductive member.

### Claim 18 (depends on 11)

The display device of claim 11, wherein an area where the TAB-IC overlaps the pad is larger than an area where the TAB-IC overlaps the remaining portion of the inspection line.