# US 10,455,692 B2 · Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,692 B2 - Document ID: US10455692B2 - Status: Granted - Kind: B2 - Application number: 15/658,165 - Filed: 2017-07-24 - Published: 2017-11-09 - Granted: 2019-10-22 - Earliest claimed: 2014-01-31 - Assignees: STMicroelectronics S.r.l. - Applicants: Stmicroelectronics S.R.L. - Inventors: Federico Giovanni Ziglioli - Web page: https://patentgrep.com/patent/US10455692B2 ## CPC - H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)} - H05K 7/02: Arrangements of circuit components or wiring on supporting structure - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 70/68: Shapes or dispositions thereof - H10W 42/271: {the arrangements being between stacked chips} - H10W 70/682: {comprising holes having chips therein} - H10W 72/0198: {batch processes} - H10W 72/073: {of die-attach connectors} - H10W 72/075: {of bond wires} - H10W 72/522: {Multilayered bond wires, e.g. having a coating concentric around a core} - H10W 72/534: {being rectangular} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/551: {Materials of bond wires} - H10W 72/552: {comprising metals or metalloids, e.g. silver} - H10W 72/5524: {comprising aluminium [Al]} - H10W 72/5525: {comprising copper [Cu]} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/652: {comprising metals or metalloids, e.g. silver} - H10W 72/655: {of outermost layers of multilayered strap connectors, e.g. material of a coating} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 72/9445: {Top-view layouts, e.g. mirror arrays} - H10W 74/014: {using batch processing} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape - H10W 90/732: {between stacked chips} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/752: {between stacked chips} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50. ## Claims ### Claim 1 A device comprising: a support that includes a recess delimited by a base portion and first and second sidewalls; an interference shield that includes: a conductive grid having a base in the base portion of the support, the base being exposed at a surface of the support, the conductive grid including a first vertical region in the first sidewall and a second vertical region in the second sidewall, the first and second vertical regions being coupled to the base; and a ribbon section coupled to the first vertical region at a first end and coupled to the second vertical region at a second end, the ribbon section having a curvature such that a length of the ribbon section is greater than a length of the surface of the conductive grid at the surface of the support, wherein the ribbon section and the conductive grid form an electromagnetic shield; and a semiconductor die located in the recess and enclosed by the interference shield, wherein the semiconductor die is between the base and the ribbon section, and wherein a portion of the semiconductor die is between the first vertical region and the second vertical region. ### Claim 2 (depends on 1) The device of claim 1 wherein the curvature of the ribbon section extends from the first end to the second end. ### Claim 3 (depends on 1) The device of claim 1 wherein the ribbon section includes a first portion including the first end, a second portion including the second end, and a third portion between the first portion and the second portion, the first and second portions having curvatures and the third portion being planar. ### Claim 4 (depends on 1) The device of claim 1 wherein the ribbon section has a concave side and a convex side, the concave side being closer to the semiconductor die than the convex side. ### Claim 5 (depends on 1) The device of claim 1 wherein the ribbon section includes a first shielding ribbon and a second shielding ribbon. ### Claim 6 (depends on 5) The device of claim 5 wherein the first and second shielding ribbons are spaced apart from and parallel to each other. ### Claim 7 (depends on 1) The device of claim 1 wherein the base is a copper mesh. ### Claim 8 (depends on 1) The device of claim 1, further comprising: a contact region in the base portion of the support, the semiconductor die electrically coupled to the contact region. ### Claim 9 (depends on 1) The device of claim 1 wherein the support is a printed-circuit board. ### Claim 10 A method, comprising: forming a support that includes a recess and a conductive grid around the recess, a surface of the conductive grid being exposed at a surface of the support; positioning a first semiconductor die in the recess; and providing a shielding ribbon, wherein the shielding ribbon is coupled to the conductive grid, the shielding ribbon having a length this is greater than a length of the surface of the conductive grid at the surface of the support, the shielding ribbon and the conductive grid forming an electromagnetic shield. ### Claim 11 (depends on 10) The method of claim 10 wherein providing the shielding ribbon includes cutting a reel of ribbon to form ribbon sections and bonding the ribbon sections to the conductive grid. ### Claim 12 (depends on 11) The method of claim 11 wherein bonding the ribbon sections includes applying a bonding force to ends of the ribbon sections via a punch with ultrasound. ### Claim 13 (depends on 10) The method of claim 10, further comprising: electrically coupling the first semiconductor die to a contact region in the support, the contact region being electrically isolated from the shielding ribbon. ### Claim 14 (depends on 10) The method of claim 10, further comprising: positioning a second semiconductor die on the first semiconductor die, the second semiconductor die extending from the recess of the support. ### Claim 15 A device, comprising: a support including a recess, a conductive grid in the support and around the recess, a surface of the conductive grid being exposed at a surface of the support; a semiconductor die in the recess and coupled to the support; and a shielding ribbon coupled to the surface of the conductive grid that is exposed at the surface of the support, the shielding ribbon having a length this is greater than a length of the surface of the conductive grid at the surface of the support, the shielding ribbon and the conductive grid forming an electromagnetic shield. ### Claim 16 (depends on 15) The device of claim 15 wherein the shielding ribbon includes a first shielding ribbon and a second shielding ribbon. ### Claim 17 (depends on 16) The device of claim 16 wherein the first and second shielding ribbons each are spaced apart from and parallel to each other, each shielding ribbon having a thickness-to-width ratio between approximately 1:2 and approximately 1:50. ### Claim 18 (depends on 15) The device of claim 15 wherein the conductive grid is a copper mesh and the support is a printed-circuit board.