# US 10,455,687 B2 · Circuit board for power supply, electronic apparatus including the same, and inductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,687 B2 - Document ID: US10455687B2 - Status: Granted - Kind: B2 - Application number: 15/230,596 - Filed: 2016-08-08 - Published: 2017-03-30 - Granted: 2019-10-22 - Earliest claimed: 2015-09-30 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Dae-woong Cho; Dong-keun Kim; Sung-woo Kim; Hyeong-gwon Kim; Ji-hoon Park - Web page: https://patentgrep.com/patent/US10455687B2 ## CPC - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H01F 17/02: without magnetic core - H01F 27/2804: {Printed windings} - H01F 27/2823: {Wires (H01F27/2866 takes precedence)} - H01F 27/2828: {Construction of conductive connections, of leads} - H01F 27/292: {Surface mounted devices} - H05K 1/0225: {Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence)} - H05K 1/0298: {Multilayer circuits} - H05K 1/181: associated with surface mounted components - H01F 27/2809: {on stacked layers} - H01F 27/324: {Insulation between coil and core, between different winding sections, around the coil; Other insulation structures} - H05K 1/111: {Pads for surface mounting, e.g. lay-out} - H05K 2201/049: PCB for one component, e.g. for mounting onto mother PCB - H05K 2201/1003: Non-printed inductor - H05K 2201/10265: Metallic coils or springs, e.g. as part of a connection element - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A circuit board for a power supply, an electronic apparatus including the same, and an inductor device are provided. The circuit board includes a first pattern arranged on a first layer of the circuit board and including a first terminal coupled to a coil, a first layer region arranged on the first layer, the coil being disposed on the first layer region, and a second pattern arranged on a second layer of the circuit board, below the first layer. The second pattern includes a first blank region located below the first layer region, and has no conductive material arranged thereon. ## Claims ### Claim 1 A circuit board capable of coupling a coil for a power supply, the circuit board comprising: a first pattern comprising a first terminal coupled to the coil, the first pattern arranged on a first layer of the circuit board; a first layer region arranged on the first layer, the coil being disposed on the first layer region by coupling to the first terminal; a second pattern comprising a second terminal electrically isolated from the coupled coil, the second pattern arranged on a second layer of the circuit board below the first layer; and a second layer region arranged on the second layer, the second layer region having no conductive material directly below the coupled coil, wherein a size of the second layer region matches a size of the first layer region. ### Claim 2 (depends on 1) The circuit board as claimed in claim 1, wherein the first terminal is coupled to a first end of the coil, and wherein the first layer region further comprises a second terminal coupled to a second end of the coil, and a blank region having no conductive material arranged thereon. ### Claim 3 (depends on 2) The circuit board as claimed in claim 2, wherein the first terminal and the second terminal protrude in a first direction corresponding to a winding direction of the coil. ### Claim 4 (depends on 1) The circuit board as claimed in claim 1, wherein the first layer region further comprises a second terminal coupled to a second end of the coil, and wherein the first terminal comprises: a first solder pad coupled to the first pattern and the first terminal of the coil; and a first extension pattern coupled to the first solder pad and protruding in a second direction perpendicular to a first direction, and wherein the second terminal comprises: a second solder pad coupled to a second pattern and the second terminal of the coil; and a second extension pattern coupled to the second solder pad and protruding in parallel to the second direction. ### Claim 5 (depends on 4) The circuit board as claimed in claim 4, wherein the first extension pattern comprises a first ninety-degree bend corresponding to a winding direction of the coil, and wherein the second extension pattern comprises a second ninety-degree bend corresponding to the winding direction of the coil. ### Claim 6 (depends on 4) The circuit board as claimed in claim 4, wherein the first extension pattern is configured to reduce normal mode noise of the coil. ### Claim 7 (depends on 1) The circuit board as claimed in claim 1, wherein the circuit board is a two-sided circuit board, wherein the first layer is disposed on an upper surface of the two-sided circuit board, and wherein the second layer is disposed on a lower surface of the two-sided circuit board. ### Claim 8 (depends on 1) The circuit board as claimed in claim 1, wherein the circuit board is a multi-layered circuit board, a ground layer is disposed on a middle of the circuit board, and the second layer is the ground layer. ### Claim 9 A power supply apparatus comprising: a coil; and a circuit board capable of coupling the coil comprising: a first pattern comprising a first terminal coupled to the coil, the first pattern arranged on a first layer of the circuit board; a first layer region arranged on the first layer, the coil being disposed on the first layer region by coupling to the first terminal; and a second pattern comprising a second terminal electrically isolated from the coupled coil, the second pattern arranged on a second layer of the circuit board below the first layer; and a second layer region arranged on the second layer, the second layer region having no conductive material directly below the coupled coil, wherein a size of the second layer region matches a size of the first layer region. ### Claim 10 (depends on 9) The power supply apparatus as claimed in claim 9, wherein the first layer region comprises a second terminal coupled to a second end of the coil, and a blank region having no conductive material arranged thereon. ### Claim 11 (depends on 10) The power supply apparatus as claimed in claim 10, wherein the first terminal and the second terminal protrude in a first direction corresponding to a winding direction of the coil. ### Claim 12 (depends on 11) The power supply apparatus as claimed in claim 11, wherein the first terminal comprises: a first solder pad coupled to the first pattern and the first terminal of the coil; and a first extension pattern coupled to the first solder pad and protruding in a second direction perpendicular to the first direction, and wherein the second terminal comprises: a second solder pad coupled to a second pattern and the second terminal of the coil; and a second extension pattern coupled to the second solder pad and protruding parallel to the second direction. ### Claim 13 (depends on 12) The power supply apparatus as claimed in claim 12, wherein the first extension pattern comprises a first ninety-degree bend corresponding to the winding direction of the coil, and the second extension pattern comprises a second ninety-degree bend corresponding to the winding direction of the coil.