# US 10,455,686 B2 · Clamping spring design to apply clamping force to SMT power amplifier device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,455,686 B2 - Document ID: US10455686B2 - Status: Granted - Kind: B2 - Application number: 15/679,919 - Filed: 2017-08-17 - Published: 2018-02-22 - Granted: 2019-10-22 - Earliest claimed: 2016-08-19 - Assignees: Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America - Applicants: Panasonic Automotive Systems Company of America, Division of Panasonic Corporation of North America - Inventors: Gerald A. Tang-Kong - Web page: https://patentgrep.com/patent/US10455686B2 ## CPC - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H03F 1/30: Modifications of amplifiers to reduce influence of variations of temperature or supply voltage {or other physical parameters (in differential amplifiers H03F3/45479)} - H03F 3/20: Power amplifiers, e.g. Class B amplifiers, Class C amplifiers (H03F3/26 - H03F3/30 take precedence) - H05K 1/181: associated with surface mounted components - H05K 5/13: assembled by screws - H05K 7/2049: {Pressing means used to urge contact, e.g. springs} - H03F 2200/447: the amplifier being protected to temperature influence - H05K 2201/066: Heatsink mounted on the surface of the printed circuit board [PCB] - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H03F: AMPLIFIERS ## Abstract A power amplifier arrangement for a motor vehicle includes a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board. A power amplifier is mounted on the second side of the printed circuit board. A bracket is supported by the housing. A clamping spring is supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink. ## Claims ### Claim 1 A power amplifier arrangement for a motor vehicle, the arrangement comprising: a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board; a power amplifier mounted on the second side of the printed circuit board; a bracket supported by the housing; and a clamping spring supported by the bracket such that the clamping spring is in biased engagement with the first side of the printed circuit board, and such that the power amplifier is pressed into engagement with the heat sink, the clamping spring including: a first leaf spring and a second leaf spring, the first and second leaf springs having substantially opposite orientations; and a rectangular frame having four walls including a first wall and a second wall, the first wall being opposite from the second wall, the first leaf spring being attached to only the first wall of the four walls and being unattached to all other structures, the second leaf spring being attached to only the second wall of the four walls and being unattached to all other structures. ### Claim 2 (depends on 1) The power amplifier arrangement of claim 1 wherein the clamping spring is supported by the bracket such that the clamping spring is in biased engagement with an area of the first side of the printed circuit board that is opposite the power amplifier. ### Claim 3 (depends on 1) The power amplifier arrangement of claim 1 wherein the rectangular frame includes retention features for engaging the bracket. ### Claim 4 (depends on 3) The power amplifier arrangement of claim 3, wherein the retention features each have a semi-spherical shape. ### Claim 5 (depends on 1) The power amplifier arrangement of claim 1 further comprising a plurality of screws attaching the heat sink to the housing. ### Claim 6 (depends on 1) The power amplifier arrangement of claim 1 wherein the first leaf spring cantilevers from the first wall of the frame, and the second leaf spring cantilevers from the second wall of the frame. ### Claim 7 A power amplifier arrangement, the arrangement comprising: a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board; a power amplifier mounted on the second side of the printed circuit board; and a clamping spring in biased engagement with the first side of the printed circuit board such that the power amplifier is pressed into engagement with the heat sink, the clamping spring including: a first leaf spring and a second leaf spring, the first and second leaf springs having substantially opposite orientations; and a rectangular frame having four walls including a first wall and a second wall, the first wall being opposite from the second wall, the first leaf spring cantilevering from the first wall of the four walls, the second leaf spring cantilevering from the second wall of the four walls. ### Claim 8 (depends on 7) The power amplifier arrangement of claim 7 wherein the frame includes retention features for engaging a supporting structure. ### Claim 9 (depends on 8) The power amplifier arrangement of claim 8 wherein the retention features each have a semi-spherical shape. ### Claim 10 (depends on 7) The power amplifier arrangement of claim 7, further comprising a plurality of screws attaching the heat sink to the housing. ### Claim 11 An electronic device arrangement for a motor vehicle, the arrangement comprising: a printed circuit board disposed between a housing on a first side of the printed circuit board and a heat sink on a second side of the printed circuit board; an electronic device mounted on the second side of the printed circuit board; a bracket supported by the housing; and a spring device supported by the bracket such that the spring device exerts a force on an area of the first side of the printed circuit board that is opposite a location of the electronic device, the spring device exerting the force such that the electronic device is pressed into engagement with the heat sink, the spring device including: a first leaf spring and a second leaf spring, the first and second leaf springs having substantially opposite orientations; and a rectangular frame having four walls including a first wall and a second wall, the first wall being opposite from the second wall, the first leaf spring being attached to only the first wall of the four walls, the second leaf spring being attached to only the second wall of the four walls. ### Claim 12 (depends on 11) The electronic device arrangement of claim 11 wherein the spring device is supported by the bracket such that the spring device is in biased engagement with an area of the first side of the printed circuit board that is opposite the electronic device. ### Claim 13 (depends on 11) The electronic device arrangement of claim 11 wherein the rectangular frame includes retention features for engaging the bracket. ### Claim 14 (depends on 13) The electronic device arrangement of claim 13 wherein the retention features each have a semi-spherical shape. ### Claim 15 (depends on 11) The electronic device arrangement of claim 11 further comprising a plurality of screws attaching the heat sink to the housing. ### Claim 16 (depends on 11) The electronic device arrangement of claim 11 wherein the first leaf spring cantilevers from the first wall of the frame, and the second leaf spring cantilevers from the second wall of the frame.